SAA7118H NXP Semiconductors, SAA7118H Datasheet - Page 164
SAA7118H
Manufacturer Part Number
SAA7118H
Description
Manufacturer
NXP Semiconductors
Datasheet
1.SAA7118H.pdf
(177 pages)
Specifications of SAA7118H
Adc/dac Resolution
9b
Screening Level
Commercial
Package Type
PQFP
Pin Count
160
Lead Free Status / RoHS Status
Compliant
Available stocks
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Part Number
Manufacturer
Quantity
Price
Part Number:
SAA7118H
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Part Number:
SAA7118H/V1
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
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Part Number:
SAA7118H/V1,557
Manufacturer:
Sigma Designs Inc
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NXP Semiconductors
SAA7118_7
Product data sheet
18.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 149. SnPb eutectic process (from J-STD-020C)
Table 150. Lead-free process (from J-STD-020C)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 149
and
Figure
150
98.
Rev. 07 — 7 July 2008
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
Multistandard video decoder with adaptive comb filter
3
3
)
)
Figure
350 to 2000
260
250
245
98) than a SnPb process, thus
220
220
350
> 2000
260
245
245
SAA7118
© NXP B.V. 2008. All rights reserved.
164 of 177
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