MT47H128M16HG-3 IT:A Micron Technology Inc, MT47H128M16HG-3 IT:A Datasheet - Page 22
![](/photos/31/34/313419/mfg557-84-fbga_sml.jpg)
MT47H128M16HG-3 IT:A
Manufacturer Part Number
MT47H128M16HG-3 IT:A
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet
1.MT47H128M16HG-3_ITA.pdf
(134 pages)
Specifications of MT47H128M16HG-3 IT:A
Organization
128Mx16
Address Bus
17b
Access Time (max)
4.5ns
Maximum Clock Rate
667MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
275mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Compliant
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Figure 11: 60-Ball FBGA Package (9mm x 11.5mm) – x4, x8
PDF: 09005aef824f87b6
2gbddr2.pdf – Rev. F 12/10 EN
Solder ball material:
SAC305 (96.5% Sn,
3% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-
reflow on Ø0.35
SMD ball pads.
Seating
60X Ø0.45
plane
8 CTR
0.12 A
0.8 TYP
Note:
A
9 8 7
1. All dimensions are in millimeters.
1.8 CTR
6.4 CTR
0.8 TYP
9 ±0.1
3 2 1
A
B
C
D
E
F
G
H
J
K
L
0.8 ±0.05
22
Ball A1 ID
11.5 ±0.1
0.155
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2Gb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.2 MAX
© 2006 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging
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