MT47H128M16HG-3 IT:A Micron Technology Inc, MT47H128M16HG-3 IT:A Datasheet - Page 26

MT47H128M16HG-3 IT:A

Manufacturer Part Number
MT47H128M16HG-3 IT:A
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet

Specifications of MT47H128M16HG-3 IT:A

Organization
128Mx16
Address Bus
17b
Access Time (max)
4.5ns
Maximum Clock Rate
667MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
275mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Compliant
Table 7: Thermal Impedance
PDF: 09005aef824f87b6
2gbddr2.pdf – Rev. F 12/10 EN
Die Rev
A
C
1
1
Package
60-ball
84-ball
60-ball
84-ball
Note:
Substrate
2-layer
4-layer
2-layer
4-layer
2-layer
4-layer
2-layer
4-layer
1. Thermal resistance data is based on a number of samples from multiple lots and should
be viewed as a typical number.
Airflow = 0m/s
θ JA (°C/W)
48.0
33.7
48.0
33.7
63.8
46.9
60.0
43.2
Airflow = 1m/s
θ JA (°C/W)
Electrical Specifications – Absolute Ratings
26
34.4
26.7
34.4
26.7
46.9
38.1
43.5
34.7
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Airflow = 2m/s
θ JA (°C/W)
2Gb: x4, x8, x16 DDR2 SDRAM
29.3
23.8
29.3
23.8
40.8
34.4
37.9
31.5
© 2006 Micron Technology, Inc. All rights reserved.
θ JB (°C/W) θ JC (°C/W)
21.6
19.7
21.6
19.7
29.9
29.2
26.0
25.5
1.6
1.6
4.3
4.1

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