MT48LC16M16A2P-75:D Micron Technology Inc, MT48LC16M16A2P-75:D Datasheet - Page 25
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MT48LC16M16A2P-75:D
Manufacturer Part Number
MT48LC16M16A2P-75:D
Description
IC, SDRAM, 256MBIT, 133MHZ, TSOP-54
Manufacturer
Micron Technology Inc
Type
SDRAMr
Series
-r
Specifications of MT48LC16M16A2P-75:D
Organization
16Mx16
Density
256Mb
Address Bus
15b
Access Time (max)
6/5.4ns
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
135mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Memory Type
DRAM - Sychronous
Memory Configuration
16 X 16
Access Time
5.4ns
Page Size
256Mbit
Memory Case Style
TSOP
No. Of Pins
54
Operating Temperature Range
0°C To +70°C
Format - Memory
RAM
Memory Size
256M (16Mx16)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
54-TSOP (0.400", 10.16mm Width)
Lead Free Status / RoHS Status
Compliant
Lead Free Status / RoHS Status
Compliant, Lead free / RoHS Compliant
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Company
Part Number
Manufacturer
Quantity
Price
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Part Number:
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PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
10. Address transitions average one transition every two clocks.
11. PC100 specifies a maximum of 4pF.
12. PC100 specifies a maximum of 5pF.
13. For -75, CL = 3 and tCK = 7.5ns; for -7E, CL = 2 and tCK = 7.5ns.
14. CKE is HIGH during REFRESH command period
5. I
6. I
7. Enables on-chip refresh and address counters.
8. Other input signals are allowed to transition no more than once every two clocks and
9. The I
measured from V
always be 1.5V referenced to crossover. Refer to Micron technical note TN-48-09.
minimum cycle time and the outputs open.
are otherwise at valid V
quency alteration for the test condition.
is actually a nominal value and does not result in a fail value.
DD
DD
specifications are tested after the device is properly initialized.
is dependent on output loading and cycle rates. Specified values are obtained with
DD
current will increase or decrease proportionally according to the amount of fre-
IL, max
and V
IH
25
or V
Electrical Specifications – I
IH,min
IL
levels.
and no longer from the 1.5V midpoint. CLK should
Micron Technology, Inc. reserves the right to change products or specifications without notice.
t
RFC (MIN) else CKE is LOW. The I
256Mb: x4, x8, x16 SDRAM
© 1999 Micron Technology, Inc. All rights reserved.
DD
Parameters
DD6
limit