SAA4956TJ NXP Semiconductors, SAA4956TJ Datasheet - Page 32
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SAA4956TJ
Manufacturer Part Number
SAA4956TJ
Description
Manufacturer
NXP Semiconductors
Datasheet
1.SAA4956TJ.pdf
(36 pages)
Specifications of SAA4956TJ
Operating Temperature (max)
70C
Operating Temperature (min)
0C
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Supplier Unconfirmed
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SAA4956TJ/V1
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Philips Semiconductors
13.5
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
1998 Dec 08
BGA, SQFP
HLQFP, HSQFP, HSOP, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
2.9-Mbit field memory with noise reduction
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods” .
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
The package footprint must incorporate solder thieves downstream and at the side corners.
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
(3)
Suitability of surface mount IC packages for wave and reflow soldering methods
, SO, SOJ
PACKAGE
not suitable
not suitable
suitable
not recommended
not recommended
(2)
WAVE
32
(3)(4)
(5)
SOLDERING METHOD
suitable
suitable
suitable
suitable
suitable
REFLOW
Preliminary specification
SAA4956TJ
(1)