MT16VDDT6464AG-40BGB Micron Technology Inc, MT16VDDT6464AG-40BGB Datasheet - Page 25
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MT16VDDT6464AG-40BGB
Manufacturer Part Number
MT16VDDT6464AG-40BGB
Description
MODULE SDRAM DDR 512MB 184DIMM
Manufacturer
Micron Technology Inc
Datasheet
1.MT16VDDT12864AY-335F2.pdf
(35 pages)
Specifications of MT16VDDT6464AG-40BGB
Memory Type
DDR SDRAM
Memory Size
512MB
Speed
400MT/s
Package / Case
184-DIMM
Lead Free Status / RoHS Status
Not Compliant
NOTE:
pdf: 09005aef80739fa5, source: 09005aef807397e5
DD16C32_64_128_256x64AG.fm - Rev. C 9/04 EN
1. Micron Technology, Inc. recommends a minimum air flow of 1 meter/second (~197 LFM) across the module.
2. The component case temperature measurements shown above were obtained experimentally. The typical system to be
3. Temperature versus air speed data is obtained by performing experiments with the system motherboard removed from
4. The memory diagnostic software used for determining worst-case component temperatures is a memory diagnostic soft-
used for experimental purposes is a dual-processor 600 MHz work station, fully loaded, with four comparable registered
memory modules. Case temperatures charted represent worst-case component locations on modules installed in the
internal slots of the system.
its case and mounted in a Eiffel-type low air speed wind tunnel. Peripheral devices installed on the system motherboard
for testing are the processor(s) and video card, all other peripheral devices are mounted outside of the wind tunnel test
chamber.
ware application developed for internal use by Micron Technology, Inc.
100
90
80
70
60
50
40
30
20
Figure 12: Component Case Temperature vs. Air Flow
T
T
max
ave
- memory stress software
- memory stress software
T
ave
Air Flow (meters/sec)
- 3D gaming software
25
256MB, 512MB, 1GB, 2GB (x64, DR)
Micron Technology, Inc., reserves the right to change products or specifications without notice.
184-PIN DDR SDRAM UDIMM
Ambient Temperature = 25º C
Minimum Air Flow
©2004 Micron Technology, Inc.