MC9S08AW60CFGE Freescale, MC9S08AW60CFGE Datasheet - Page 320

• Manufacturer Part Number: MC9S08AW60CFGE
• Manufacturer: Freescale

Specifications of MC9S08AW60CFGE

• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 40MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 2KB
• # I/os (max): 34
• Number Of Timers - General Purpose: 8
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 44
• Package Type: LQFP
• Program Memory Type: Flash
• Program Memory Size: 60KB
• Lead Free Status / RoHS Status: Compliant

Appendix B Ordering Information and Mechanical Drawings
B.2
The orderable part numbers for the MC9S08AC16 Series devices varies according to the device family.
Refer to
320
Core
Family
- AW
Status
- S = Auto Qualified
Main Memory Type
- 9 = Flash-based
Core
Family
- AC
Status
- MC = Consumer &
Main Memory Type
- 9 = Flash-based
Industrial
Figure B-1
Orderable Part Numbering System
and
Figure B-1. Consumer & Industrial Device Numbering System
Figure B-2
MC
S
Figure B-2. Automotive Device Numbering System
9
9
MC9S08AC16 Series Data Sheet, Rev. 8
S08
for examples.
S08
Memory Size
(Approx)
- 16 Kbytes
- 8 Kbytes
AW n
AC n
A
Device
Version
C
E0
xx
C
E
xx
Pb Free Indicator
- E = Pb Free
Temperature Option
- C = -40 to 85 °C
- V = -40 to 105 °C
- M = -40 to 125 °C
Memory Size
(Approx)
- 16 Kbytes
- 8 Kbytes
Package Designator
Two letter descriptor
(refer to
Package Designator
Two letter descriptor
(refer to
Temperature Range
- C = -40 to 85 °C
- V = -40 to 105 °C
- M = -40 to 125 °C
Mask Set Identifier
- Alpha character references
- Numeric character identifies
wafer fab.
mask revision.
- E = Chandler
Freescale Semiconductor
Table
Table
B-2).
B-3).