MCIMX253CJM4A Freescale, MCIMX253CJM4A Datasheet - Page 125

• Manufacturer Part Number: MCIMX253CJM4A
• Manufacturer: Freescale

Specifications of MCIMX253CJM4A

• Lead Free Status / RoHS Status: Compliant

4.2
Table 98
Freescale Semiconductor
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Contact Name
NGND_ADC
FUSE_VDD
MPLL_GND
MPLL_VDD
Maximum solder bump diameter measured parallel to datum A.
Datum A, the seating plane, is determined by the spherical crowns of the solder bumps.
Parallelism measurement shall exclude any effect of mark on top surface of package.
BATT_VDD
Table 98. 17 17 mm Package Ground, Power Sense, and Reference Contact Assignments
shows the 17 17 mm package ground, power, sense, and reference contact assignments.
Ground, Power, Sense, and Reference Contact Assignments
Case 17x17 mm, 0.8 mm Pitch
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 6
T17
U17
U18
Y13
P10
Figure 98.
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17 17 i.MX25 Production Package
Contact Assignment
125