PCA9306DP-T NXP Semiconductors, PCA9306DP-T Datasheet - Page 16

PCA9306DP-T

Manufacturer Part Number
PCA9306DP-T
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PCA9306DP-T

Operating Temperature (max)
85C
Operating Temperature (min)
-40C
Package Type
TSSOP
Pin Count
8
Mounting
Surface Mount
Lead Free Status / RoHS Status
Compliant
NXP Semiconductors
Fig 16. Package outline SOT765-1 (VSSOP8)
PCA9306
Product data sheet
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT765-1
max.
A
1
0.15
0.00
A 1
8
1
Z
0.85
0.60
A 2
y
IEC
e
0.12
A 3
pin 1 index
D
0
0.27
0.17
b p
b p
All information provided in this document is subject to legal disclaimers.
MO-187
0.23
0.08
5
JEDEC
4
c
w
REFERENCES
D
Rev. 6 — 25 November 2010
2.1
1.9
M
(1)
Dual bidirectional I
E
2.4
2.2
(2)
c
JEITA
scale
2.5
0.5
e
A
H E
3.2
3.0
A 2
detail X
A 1
0.4
2
L
C-bus and SMBus voltage-level translator
H E
E
0.40
0.15
L p
0.21
0.19
Q
5 mm
L
L p
PROJECTION
EUROPEAN
Q
0.2
v
A
(A 3 )
0.13
w
X
θ
v
PCA9306
M
0.1
y
© NXP B.V. 2010. All rights reserved.
A
ISSUE DATE
02-06-07
Z
0.4
0.1
(1)
SOT765-1
θ
16 of 26

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