CBTU4411EE-T NXP Semiconductors, CBTU4411EE-T Datasheet - Page 14

CBTU4411EE-T

Manufacturer Part Number
CBTU4411EE-T
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of CBTU4411EE-T

Operating Temperature (max)
85C
Operating Temperature (min)
0C
Mounting
Surface Mount
Lead Free Status / RoHS Status
Compliant
NXP Semiconductors
14. Package outline
Fig 14. Package outline SOT856-1 (LFBGA72)
CBTU4411_3
Product data sheet
LFBGA72: plastic low profile fine-pitch ball grid array package; 72 balls; body 7 x 7 x 1.05 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SOT856-1
OUTLINE
VERSION
max
1.5
ball A1
index area
ball A1
index area
A
0.3
0.2
A
1
K
H
G
D
C
B
A
L
J
F
E
1.20
0.95
A
2
IEC
1
2
0.35
0.25
b
3
4
e
7.2
6.8
D
5
e
D
6
1
JEDEC
7.2
6.8
7
E
8
REFERENCES
9
0.5
0
e
b
10
Rev. 03 — 12 October 2009
11-bit DDR2 SDRAM MUX/bus switch with 12
11
e
5
1
JEITA
scale
e
5
2.5
2
B
e
0.15
A
E
w
v
v
e
M
M
2
C
C
0.05
w
A
5 mm
B
A
0.08
y
A
2
A
0.1
y
1
1
y
1
PROJECTION
EUROPEAN
C
CBTU4411
© NXP B.V. 2009. All rights reserved.
C
X
y
ISSUE DATE
ON resistance
04-04-27
04-05-12
SOT856-1
14 of 20

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