934055510215 NXP Semiconductors, 934055510215 Datasheet

934055510215

Manufacturer Part Number
934055510215
Description
Manufacturer
NXP Semiconductors
Type
Attenuator/Switchr
Datasheet

Specifications of 934055510215

Configuration
Dual Common Cathode
Forward Current
100mA
Forward Voltage
1.1V
Power Dissipation
250mW
Operating Temperature Classification
Military
Reverse Voltage
175V
Mounting
Surface Mount
Maximum Series Resistance @ Minimum If
40@0.5mAOhm
Maximum Series Resistance @ Maximum If
1.35@100mAOhm
Typical Carrier Life Time
1.55us
Operating Temperature (max)
150C
Operating Temperature (min)
-65C
Pin Count
3
Applications Frequency Range
SHF
Lead Free Status / RoHS Status
Compliant
Product specification
Supersedes data of 1999 Jul 01
DATA SHEET
BAP64-05
Silicon PIN diode
ook, halfpage
DISCRETE SEMICONDUCTORS
M3D088
1999 Aug 19

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934055510215 Summary of contents

Page 1

DATA SHEET ook, halfpage BAP64-05 Silicon PIN diode Product specification Supersedes data of 1999 Jul 01 DISCRETE SEMICONDUCTORS M3D088 1999 Aug 19 ...

Page 2

... NXP Semiconductors Silicon PIN diode FEATURES  High voltage, current controlled  RF resistor for RF attenuators and switches  Low diode capacitance  Low diode forward resistance  Low series inductance  For applications GHz. APPLICATIONS  RF attenuators and switches. DESCRIPTION Two planar PIN diodes in common cathode configuration in a SOT23 small plastic SMD package ...

Page 3

... NXP Semiconductors Silicon PIN diode ELECTRICAL CHARACTERISTICS = 25 C unless otherwise specified SYMBOL PARAMETER Per diode V forward voltage F I reverse current R C diode capacitance d diode forward resistance r D  charge carrier life time L L series inductance S Note 1. Guaranteed on AQL basis: inspection level S4, AQL 1.0. ...

Page 4

... NXP Semiconductors Silicon PIN diode GRAPHICAL DATA 2 10 handbook, halfpage r D (Ω −1 10 −  100 MHz Fig.2 Forward resistance as a function of forward current; typical values handbook, halfpage handbook, halfpage 2 2 (1) (1) (2) ( (dB) (dB) −1 −1 (3) (3) (4) (4) −2 −2 −3 −3 − ...

Page 5

... NXP Semiconductors Silicon PIN diode PACKAGE OUTLINE Plastic surface-mounted package; 3 leads DIMENSIONS (mm are the original dimensions UNIT max. 1.1 0.48 0.15 mm 0.1 0.9 0.38 0.09 OUTLINE VERSION IEC SOT23 1999 Aug scale 3.0 1.4 2.5 1.9 0.95 2.8 1.2 2.1 REFERENCES ...

Page 6

... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the ...

Page 7

... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...

Page 8

... Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. ...

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