RC82545EM 845633 Intel, RC82545EM 845633 Datasheet - Page 12

• Manufacturer Part Number: RC82545EM 845633
• Manufacturer: Intel

Specifications of RC82545EM 845633

• Lead Free Status / RoHS Status: Not Compliant

82545EM — Networking Silicon
2.7
8
Technology Features
364-pin Ball Grid Array (BGA) package
Footprint compatible with the 82544GC, 82545GM,
and 82546EB controllers
Implemented in 0.15µ CMOS process
0 C to 70 C (maximum) operating temperature
Heat sink or forced airflow not required
65 C to 140 C storage temperature range
3.3 V (5 V tolerant) PCI signaling with power
dissipation less than 2.0 W (maximum)
Features
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21 mm x 21 mm component making LOM designs
easier
Single port or dual port implementation on the
same board with minor option changes
Offers lowest geometry to minimize power and
size while maintaining Intel quality reliability
standards
Simple thermal design
Lower power requirements
Benefits
Datasheet