IS43R16800CC-6TL ISSI, Integrated Silicon Solution Inc, IS43R16800CC-6TL Datasheet

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IS43R16800CC-6TL

Manufacturer Part Number
IS43R16800CC-6TL
Description
DRAM 128M (8Mx16) 166MHz Commercial Temp
Manufacturer
ISSI, Integrated Silicon Solution Inc
Type
DDR SDRAMr
Datasheet

Specifications of IS43R16800CC-6TL

Organization
8Mx16
Density
128Mb
Address Bus
14b
Access Time (max)
700ps
Maximum Clock Rate
167MHz
Operating Supply Voltage (typ)
2.5V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
2.7V
Operating Supply Voltage (min)
2.3V
Supply Current
250mA
Pin Count
66
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Data Bus Width
16 bit
Package / Case
TSOP-66
Memory Size
128 MB
Maximum Clock Frequency
166 MHz
Access Time
0.7 ns
Supply Voltage (max)
2.7 V
Supply Voltage (min)
2.3 V
Maximum Operating Current
250 A
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Compliant

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IS43R16800CC
8Mx16
128Mb DDR Synchronous DRAM
FEATURES:
ADDRESS TABLE
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the
latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc.
Rev. 00A
11/24/08
Parameter
Configuration
Bank Address Pins
Autoprecharge Pins
Row Addresses
Column Addresses
Refresh Count
V
Double data rate architecture; two data transfers
per clock cycle.
Bidirectional , data strobe (DQS) is transmitted/
received with data
Differential clock input (CLK and /CLK)
DLL aligns DQ and DQS transitions with CLK
transitions edges of DQS
Commands entered on each positive CLK edge;
Data and data mask referenced to both edges of
DQS
4 bank operation controlled by BA0 , BA1
(Bank Address)
/CAS latency -2.0 / 2.5 / 3.0 (programmable) ;
Burst length -2 / 4 / 8 (programmable)
Burst type -Sequential / Interleave (program-
mable)
Auto precharge/ All bank precharge controlled
by A10
4096 refresh cycles / 64ms (4 banks concurrent
refresh)
Auto refresh and Self refresh
Row address A0-11 / Column address A0-8
SSTL_2 Interface
Package:
66-pin TSOP II
Temperature Range:
Commercial (0
Industrial (-40
dd
=V
ddq
= 2.5V+0.2V (-5, -6, -75)
o
C to +85
o
C to +70
8M x 16
2M x 16 x 4 banks
BA0, BA1
A10/AP
A0 – A11
A0 – A8
4096 / 64ms
o
C)
o
C)
DESCRIPTION:
IS43R16800CC is a 4-bank x 2,097,152-word x 16bit
double data rate synchronous DRAM , with SSTL_2
interface. All control and address signals are referenced
to the rising edge of CLK. Input data is registered on
both edges of data strobe, and output data and data
strobe are referenced on both edges of CLK. The device
achieves very high speed clock rate up to 200 MHz.
KEY TIMING PARAMETERS
Parameter
Clk Cycle Time
Clk Frequency
Access Time from Clock
CAS Latency = 3
CAS Latency = 2.5
CAS Latency = 2
CAS Latency = 3
CAS Latency = 2.5
CAS Latency = 2
CAS Latency = 3
CAS Latency = 2.5
CAS Latency = 2
PRELIMINARY INFORMATION
JANUARY 2009
+0.70 +0.70 +0.75
+0.70 +0.70 +0.75
+0.75 +0.75 +0.75
200
200
143
7.5
-5
5
5
167
167
143
7.5
-6
6
6
143
143
143
-75
7.5
7.5
7.5
MHz
MHz
MHz
Unit
ns
ns
ns
ns
ns
ns
1

Related parts for IS43R16800CC-6TL

IS43R16800CC-6TL Summary of contents

Page 1

... PRELIMINARY INFORMATION JANUARY 2009 DESCRIPTION: IS43R16800CC is a 4-bank x 2,097,152-word x 16bit double data rate synchronous DRAM , with SSTL_2 interface. All control and address signals are referenced to the rising edge of CLK. Input data is registered on both edges of data strobe, and output data and data strobe are referenced on both edges of CLK ...

Page 2

... IS43R16800CC PIN CONFIGURATIONS 66 pin TSOP - Type II for x16 DQ0 DQ1 4 DQ2 DQ3 7 DQ4 DQ5 10 11 DQ6 DQ7 DDQ LDQS VDD 18 DNU 19 LDM CAS 22 RAS BA0 26 BA1 27 A10/ VDD PIN DESCRIPTION: A0-A11 Row Address Input A0-A8 Column Address Input BA0, BA1 Bank Select Address DQ0 – ...

Page 3

... I Preliminary Preliminary IS43R16800CC I PIN FUNCTION SYMBOL TYPE CLK, /CLK Input CKE Input /CS Input /RAS, /CAS, /WE Input A0-11 Input BA0,1 Input D Input / Output DQ0-15 D Input / Output UDQS, LDQS D Input UDM, LDM Power Supply Power Supply DDQ, SSQ Vref Input Integrated Silicon Solution, Inc. ...

Page 4

... IS43R16800CC BLOCK DIAGRAM x16 DLL Memory Array Bank #0 Mode Re gister Addres s B uffer A0- UDQS I/O B uffer DQ S Buffer Memory Memory Array Array Control C ircu itry Control Signal B uffer Cl ock B uffer /CS /RAS /CAS CLK /CLK CKE Memory Array /WE UDM , LD M Integrated Silicon Solution, Inc. ...

Page 5

... Preliminary Preliminary IS43R16800CC I BASIC FUNCTIONS ISSI's 128-Mbit DDR SDRAM provides basic functions, bank (row) activate, burst read / write, bank (row) precharge, and auto / self refresh. Each command is defined by control signals of /RAS, /CAS and /WE at CLK rising edge. In addition to 3 signals, /CS , CKE and A10 are used as chip select, refresh option, and precharge option, respectively ...

Page 6

... Preliminary Preliminary I IS43R16800CC I COMMAND TRUTH TABLE COMMAND MNEMONIC DESEL Deselect NOP No Operation Row Address Entry & ACT Bank Activate PRE Single Bank Precharge PREA Precharge All Banks Column Address Entry WRITE & Write Column Address Entry & Write with WRITEA Auto-Precharge ...

Page 7

... Preliminary Preliminary IS43R16800CC FUNCTION TRUTH TABLE Current State /CS /RAS /CAS /WE Address IDLE BA, CA, A10 BA BA, A10 ROW ACTIVE BA, CA, A10 BA, CA, A10 BA BA, A10 READ(Auto- Precharge Disabled BA, CA, A10 BA, CA, A10 BA BA, A10 Integrated Silicon Solution, Inc. DDR SDRAM (Rev.1.1) Rev. 00A ...

Page 8

... I Preliminary Preliminary IS43R16800CC I FUNCTION TRUTH TABLE (continued) Current State /CS /RAS /CAS /WE Address WRITE(Auto- Precharge Disabled BA, CA, A10 BA READ with Auto-Precharge BA, CA, A10 BA WRITE with Auto-Precharge BA, CA, A10 BA DDR SDRAM (Rev.1.1) 8 256M Double Data Rate Synchronous DRAM Command DESEL NOP L BA TERM ...

Page 9

... Preliminary Preliminary IS43R16800CC FUNCTION TRUTH TABLE (continued) Current State /CS /RAS /CAS /WE Address PRE- CHARGING BA, CA, A10 BA BA, A10 ROW ACTIVATING BA, CA, A10 BA BA, A10 WRITE RE COVERING BA, CA, A10 BA BA, A10 Integrated Silicon Solution, Inc. DDR SDRAM (Rev.1.1) Rev. 00A 11/24/08 256M Double Data Rate Synchronous DRAM ...

Page 10

... I Preliminary Preliminary IS43R16800CC I FUNCTION TRUTH TABLE (continued) Current State /CS /RAS /CAS /WE Address REFRESHING MODE REGISTER SETTING ABBREVIATIONS: H=High Level, L=Low Level, X=Don't Care BA=Bank Address, RA=Row Address, CA=Column Address, NOP=No Operation NOTES: 1. All entries assume that CKE was High during the preceding clock cycle and the current clock cycle. ...

Page 11

... Preliminary Preliminary IS43R16800CC FUNCTION TRUTH TABLE for CKE Current State CKE n-1 CKE SELF- REFRESHING POWER DOWN ALL BANKS IDLE ANY STATE other than listed H L above ABBREVIATIONS: H=High Level, L=Low Level, X=Don't Care NOTES: 1. CKE Low to High transition will re-enable CLK and other inputs asynchronously. ...

Page 12

... I Preliminary Preliminary IS43R16800CC I SIMPLIFIED STATE DIAGRAM POWER APPLIED POWER PREA ON MODE REGISTER SET WRITE 12 DDR SDRAM (Rev.1.1) 256M Double Data Rate Synchronous DRAM PRE CHARGE ALL REFS MRS MRS REFA IDLE CKEH Active ACT Power Down CKEL CKEH ROW ACTIVE WRITE ...

Page 13

... IS43R16800CC POWER ON SEQUENCE Before starting normal operation, the following power on sequence is necessary to prevent a SDRAM from damaged or multifunctioning. 1. Apply VDD before or the same time as VDDQ 2. Apply VDDQ before or at the same time as VTT & Vref 3. Maintain stable condition for 200us after stable power and CLK, apply NOP or DSEL 4 ...

Page 14

... IS43R16800CC EXTENDED MODE REGISTER DLL disable / enable mode can be programmed by setting the extended mode register (EMRS). The extended mode register stores these data until the next EMRS command, which may be issued when all banks are in idle state. After tMRD from a EMRS command, the DDR SDRAM is ready for new command ...

Page 15

... Preliminary Preliminary IS43R16800CC /CLK CLK Read Command Address Y DQS DQ CL= 2 /CAS BL= 4 Latency Initial Address Integrated Silicon Solution, Inc. DDR SDRAM (Rev.1.1) Rev. 00A 11/24/08 256M Double Data Rate Synchronous DRAM Burst Length Column Addressing Sequential Zentel Electronics Corporation A3S56D30/40ETP Write ...

Page 16

... IS43R16800CC ABSOLUTE MAXIMUM RATINGS Symbol Parameter Vdd Supply Voltage VddQ Supply Voltage for Output VI Input Voltage VO Output Voltage IO Output Current Pd Power Dissipation Topr Operating Temperature Tstg Storage Temperature DC OPERATING CONDITIONS o (Ta unless otherwise noted) Parameter Supply Voltage Supply Voltage for Output ...

Page 17

... IS43R16800CC AVERAGE SUPPLY CURRENT from Vdd (Vdd = VddQ = 2.5V + 0.2V, Vss = VssQ = 0V, Output Open, unless otherwise noted) Parameter/Test Conditions Symbol OPERATING CURRENT: One Bank; Active-Read-Precharge;Burst = 2; t IDD1 MIN MIN; IOUT= 0mA; Address and control inputs changing once per clock cycle PRECHARGE POWER-DOWN STANDBY CURRENT: All banks idle; ...

Page 18

... I Preliminary Preliminary IS43R16800CC I AC TIMING REQUIREMENTS Symbol AC Characteristics Parameter tAC DQ Output access time from CLK//CLK tDQSCK DQS Output access time from CLK//CLK tCH CLK High level width tCL CLK Low level width tCK CLK cycle time tDS Input Setup time (DQ,DM) ...

Page 19

... IS43R16800CC AC TIMING REQUIREMENTS(Continues) Symbol AC Characteristics Parameter tRAS Row Active time tRC Row Cycle time(operation) tRFC Auto Ref. to Active/Auto Ref. command period tRCD Row to Column Delay tRP Row Precharge time tRRD Act to Act Delay time tWR Write Recovery time tDAL Auto Precharge write recovery + precharge time ...

Page 20

... I Preliminary Preliminary IS43R16800CC I Notes 1. All voltages referenced to Vss. 2. Tests for AC timing, IDD, and electrical, AC and DC characteristics, may be conducted at nominal reference/supply voltage levels, but the related specifications and device operation are guaranteed for the full voltage range specified timing and IDD tests may use a VIL to VIH swing 1.5V in the test environment, but input timing is still referenced to VREF (or to the crossing point for CK//CK), and parameter specifications are guaranteed for the specified AC input levels under normal use conditions ...

Page 21

... IS43R16800CC Read Operation /CLK CLK Cmd & Add. tRPRE DQS DQ Write Operation / tDQSS=max. /CLK CLK tDQSS tWPRES DQS tWPRE DQ Write Operation / tDQSS=min. /CLK CLK tDQSS DQS tWPRES tWPRE DQ Integrated Silicon Solution, Inc. Rev. 00A 11/24/08 tCK tCH tDQSCK tQH tAC tDSS ...

Page 22

... I Preliminary Preliminary IS43R16800CC I OPERATIONAL DESCRIPTION BANK ACTIVATE The DDR SDRAM has four independent banks. Each bank is activated by the ACT command with the bank addresses (BA0,1). A row is indicated by the row address A0-11. The minimum activation interval between one bank and the other bank is tRRD. ...

Page 23

... Preliminary I Preliminary IS43R16800CC READ After tRCD from the bank activation, a READ command can be issued. 1st Output data is available after the /CAS Latency from the READ, followed by (BL-1) consecutive data when the Burst Length is BL. The start address is specified by A0-8, and the address sequence of burst data is defined by the Burst Type ...

Page 24

... IS43R16800CC READ with Auto-Precharge (BL=8, CL=2,2.5,3. /CLK CLK Command ACT tRCD Xa A0-9,11 Xa A10 BA0,1 00 DQS CL=2 DQ DQS CL=2.5 DQ DQS CL=3 BL/2 + tRP READ BL/2 tRP Qa0 Qa1 Qa2 Qa3 Qa4 Qa5 Qa6 Qa0 Qa1 Qa2 Qa3 Qa4 Qa5 Qa0 Qa1 Qa2 ...

Page 25

... Preliminary Preliminary I IS43R16800CC WRITE After tRCD from the bank activation, a WRITE command can be issued. 1st input data is set from the WRITE command with data strobe input, following (BL-1) data are written into RAM, when the Burst Length is BL. The start address is specified by A0-8, and the address sequence of burst data is defined by the Burst Type ...

Page 26

... I Preliminary Preliminary IS43R16800CC /CLK CLK Command ACT tRC A0-9, A10 Xa 00 BA0,1 DQS DQ DDR SDRAM (Rev.1.1) 26 256M Double Data Rate Synchronous DRAM WRITE with Auto-Precharge (BL= WRITE Da0 Da1 Da2 Da3 Da4 Da5 Da6 Da7 A3S56D30/40ETP ACT tDAL Integrated Silicon Solution, Inc. ...

Page 27

... Preliminary Preliminary IS43R16800CC I BURST INTERRUPTION [Read Interrupted by Read] Burst read operation can be interrupted by new read of any bank. Random column access is allowed. READ to READ interval is minimum 1CLK. /CLK CLK Command READ READ A0-9, A10 00 00 BA0,1 DQS DQ [Read Interrupted by precharge] Burst read operation can be interrupted by precharge of the same bank. READ to PRE interval is minimum 1 CLK ...

Page 28

... I Preliminary Preliminary IS43R16800CC I /CLK CLK Command DQS DQ Command DQS CL=2.5 DQ Command DQS DQ /CLK CLK Command DQS DQ Command DQS CL=3.0 DQ Command DQS DQ DDR SDRAM (Rev.1.1) 28 256M Double Data Rate Synchronous DRAM Read Interrupted by Precharge (BL=8) READ PRE READ PRE READ PRE Q0 Q1 ...

Page 29

... Preliminary Preliminary IS43R16800CC [Read Interrupted by Burst Stop] Burst read operation can be interrupted by a burst stop command(TERM). READ to TERM interval is minimum 1 CLK. A TERM command to output disable latency is equivalent to the /CAS Latency result, READ to TERM interval determines valid data length to be output. The figure below shows examples of BL=8 ...

Page 30

... IS43R16800CC Command Command CL=3.0 Command [Read Interrupted by Write with TERM] Command CL=2.0 Command CL=2.5 Command CL=3.0 30 Read Interrupted by TERM (BL=8) /CLK CLK READ TERM DQS DQ READ TERM DQS DQ READ TERM DQS DQ Read Interrupted by TERM (BL=8) /CLK CLK READ TERM DQS Q0 Q1 ...

Page 31

... IS43R16800CC [Write interrupted by Write] Burst write operation can be interrupted by write of any bank. Random column access is allowed. WRITE to WRITE interval is minimum 1 CLK. /CLK CLK Command WRITE WRITE A0-9, A10 0 0 BA0 DQS DQ Dai0 [Write interrupted by Read] Burst write operation can be interrupted by read of the same or the other bank. Random column access is allowed. Internal WRITE to READ command interval(tWTR) is minimum 1 CLK. The input data the interrupting READ cycle is " ...

Page 32

... I Preliminary Preliminary IS43R16800CC I [Write interrupted by Precharge] Burst write operation can be interrupted by precharge of the same or all bank. Random column access is allowed. tWR is referenced from the first positive CLK edge after the last data input. Write Interrupted by Precharge (BL=8, CL=2.5) /CLK CLK WRITE ...

Page 33

... Preliminary Preliminary I IS43R16800CC [Initialize and Mode Register sets] /CLK CLK CKE Command NOP PRE A0-11 1 A10 BA0,1 DQS DQ Extended Mode Register Set [AUTO REFRESH] Single cycle of auto-refresh is initiated with a REFA(/CS=/RAS=/CAS=L,/WE=CKE=H) command. The refresh address is generated internally. 4096 REFA cycles within 64ms refresh 128Mbits memory cells ...

Page 34

... IS43R16800CC [SELF REFRESH] Self -refresh mode is entered by issuing a REFS command (/CS=/RAS=/CAS=L,/WE=H,CKE=L). Once the self-refresh is initiated maintained as long as CKE is kept low. During the self- refresh mode, CKE is asynchronous and the only enable input, all other inputs including CLK are disabled and ignored, so that power consumption due to synchronous inputs is saved. To exit the self-refresh, supplying stable CLK inputs, asserting DESEL or NOP command and then asserting CKE for longer than tXSNR/tXSRD ...

Page 35

... IS43R16800CC [Power DOWN] The purpose of CLK suspend is power down. CKE is synchronous input except during the self- refresh mode. A command at cycle is ignored. From CKE=H to normal function, DLL recovery time is NOT required in the condition of the stable CLK operation during the power down mode. ...

Page 36

... IS43R16800CC-6TL 133 MHz 7.5 IS43R16800CC-75TL Industrial Range: -40°C to +85°C Frequency Speed (ns) Order Part No. 200 MHz 5 IS43R16800CC-5TLI 166 MHz 6 IS43R16800CC-6TLI 133 MHz 7.5 IS43R16800CC-75TLI 36 = 2.5V dd Package 66-pin TSOP-II, Lead-free 66-pin TSOP-II, Lead-free 66-pin TSOP-II, Lead-free Package 66-pin TSOP-II, Lead-free 66-pin TSOP-II, Lead-free 66-pin TSOP-II, Lead-free Integrated Silicon Solution, Inc ...

Page 37

... IS43R16800CC Integrated Silicon Solution, Inc. Rev. 00A 11/24/08 37 ...

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