IS43R16800CC-6TL ISSI, Integrated Silicon Solution Inc, IS43R16800CC-6TL Datasheet - Page 35

• Manufacturer Part Number: IS43R16800CC-6TL
• Description: DRAM 128M (8Mx16) 166MHz Commercial Temp
• Manufacturer: ISSI, Integrated Silicon Solution Inc
• Type: DDR SDRAMr

Specifications of IS43R16800CC-6TL

• Organization: 8Mx16
• Density: 128Mb
• Address Bus: 14b
• Access Time (max): 700ps
• Maximum Clock Rate: 167MHz
• Operating Supply Voltage (typ): 2.5V
• Package Type: TSOP-II
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 2.7V
• Operating Supply Voltage (min): 2.3V
• Supply Current: 250mA
• Pin Count: 66
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Data Bus Width: 16 bit
• Package / Case: TSOP-66
• Memory Size: 128 MB
• Maximum Clock Frequency: 166 MHz
• Access Time: 0.7 ns
• Supply Voltage (max): 2.7 V
• Supply Voltage (min): 2.3 V
• Maximum Operating Current: 250 A
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Compliant

IS43R16800CC
Integrated Silicon Solution, Inc.
Rev. 00A
11/24/08
[DM CONTROL]
[Power DOWN]
DM is defined as the data mask for writes. During writes,DM masks input data word by word. DM
to write mask latency is 0.
The purpose of CLK suspend is power down. CKE is synchronous input except during the self-
refresh mode. A command at cycle is ignored. From CKE=H to normal function, DLL recovery time
is NOT required in the condition of the stable CLK operation during the power down mode.
Command
Command
Command
/CLK
DQS
CLK
DM
DQ
/CLK
CKE
CKE
CLK
WRITE
PRE
ACT
masked by DM=H
D0 D1
NOP
NOP
D3 D4
Power Down by CKE
DM Function(BL=8,CL=2)
Standby Power Down
D5 D6
Active Power Down
D7
READ
NOP
NOP
Don't Care
Valid
Valid
Q0
Q1
tXPNR/tXPRD
Q2
Q3
Q4
Q5
Q6
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