IP4057CX10/LF,135 NXP Semiconductors, IP4057CX10/LF,135 Datasheet - Page 51

• Manufacturer Part Number: IP4057CX10/LF,135
• Description: IC USB2.0 EMI FILT ESD PRO 10CSP
• Manufacturer: NXP Semiconductors

Specifications of IP4057CX10/LF,135

• Resistance (ohms): 33, 1.3K
• Capacitance: 30pF
• Package / Case: 10-CSP
• Resistance In Ohms: 33, 1.30K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -
• Tolerance: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 934057856135

100
Minimized outline drawings and refl ow soldering footprint
4-/5-Pin SMD Packages
Dimensions in mm
SOT353 (SC-88A)
SOT223 (SC-73)
SOT143B
SOT665
2
2.35
1
0.75
0.75
0.45
(2×)
1.3
(4×)
(2×)
(3×)
0.7
0.7
0.7
0.4
(2×)
(4×)
1.2
0.6
(3×)
0.6
(4×)
(4×)
0.5
0.6
0.45
(4×)
(4×)
1
0.9
0.5
0.75
(3×)
(3×)
0.6
0.5
0.9
2.3
1
2.65
6.15
3.85
3.6
3.5
1.2
(3×)
1.3
(3×)
7
3.25
1.9
2.45
SOT353 (SC-88A)
2.1
1.6
1.7
0.9
SOT223 (SC-73)
2.3
0.6
0.95
SOT143B
SOT665
0.6
0.65
3.9
(4×)
0.5
2
6.1
0.4
0.538
3
7.65
(4×)
0.6
(5×)
0.4
0.325
0.25
(2×)
0.375
(2×)
0.3
Dimensions in mm
0.55
Dimensions in mm
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
solder lands
solder resist
solder paste
occupied area
solder lands
placement area
solder paste
occupied area
sot353_fr
Minimized outline drawings and refl ow soldering footprint
6-Pin SMD Packages
Dimensions in mm
1.68
1.58
0.35
0.25
SOT873 (HVSON8)
1
8
SOT363 (SC-88)
SOT457 (SC-74)
1.95
2
7
2.3
2.2
3.4
3.2
3
6
SOT666
4
5
0.52
0.42
0.55
0.45
3.4
3.2
1
2.35
0.075
0.150
0.050
2
1.5
3.3
1.7
solder lands
solder resist
clearance
solder paste
placement area
occupied area
(4×)
0.6
2.825
1.075
(4×)
0.5
0.538
0.95
0.95
0.55
(2×)
(4×)
(4×)
(6×)
(6×)
0.5
0.6
0.7
0.8
0.45
(4×)
(4×)
0.5
SOT873 (HVSON8)
2.65
1.8
3.45
1.95
SOT363 (SC-88)
2.4
SOT457 (SC-74)
4.550 OA
2.75
2.45
2.1
1.6
1.7
1.600 CU
(2×)
SOT666
0.6
0.700 SP
(2×)
0.65
(2×)
0.6
0.45
(6×)
0.4 (2×)
0.55
(6×)
3.600 PA + OA
2.500 OA
1.400 SP
2.300 CU
0.325
0.25
(2×)
(4×)
0.500 SP
0.500 SP
0.400 SP gap
0.400 SP gap
0.400 SP gap
0.400 SP gap
0.375
0.3
(2×)
(4×)
0.300 CU (8×)
0.550 OA (8
0.550 OA (8×)
0.400
2.400 CU
solder lands
solder resist
solder paste
occupied area
3.600 PA +OA
solder lands
placement area
solder paste
occupied area
solder lands
solder resist
solder paste
occupied area
4.300 CU
101