STM32F205ZFT6 STMicroelectronics, STM32F205ZFT6 Datasheet - Page 146
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STM32F205ZFT6
Manufacturer Part Number
STM32F205ZFT6
Description
MCU ARM 768KB FLASH 144LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32F205RBT6.pdf
(163 pages)
Specifications of STM32F205ZFT6
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
120MHz
Connectivity
CAN, I²C, IrDA, LIN, MMC, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
114
Program Memory Size
768KB (768K x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
132K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 24x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-11165
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32F205ZFT6
Manufacturer:
STMicroelectronics
Quantity:
364
Company:
Part Number:
STM32F205ZFT6
Manufacturer:
STMicroelectronics
Quantity:
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Part Number:
STM32F205ZFT6
Manufacturer:
ST
Quantity:
20 000
Package characteristics
6.2
146/163
Thermal characteristics
The maximum chip-junction temperature, T
using the following equation:
Where:
●
●
●
●
P
taking into account the actual V
application.
Table 86.
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
I/O
Symbol
Θ
max represents the maximum power dissipation on output pins where:
T
Θ
P
P
internal power.
P
JA
A
D
INT
I/O
JA
max is the maximum ambient temperature in °C,
max is the sum of P
is the package junction-to-ambient thermal resistance, in °C/W,
max = Σ (V
max is the product of I
Thermal resistance junction-ambient
LQFP 64 - 10 × 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
WLCSP64+2 - 0.400 mm pitch
Thermal resistance junction-ambient
LQFP100 - 14 × 14 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP144 - 20 × 20 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP176 - 24 × 24 mm / 0.5 mm pitch
Thermal resistance junction-ambient
UFBGA176 - 10× 10 mm / 0.5 mm pitch
Package thermal characteristics
OL
× I
OL
INT
T
) + Σ((V
Parameter
J
Doc ID 15818 Rev 6
max = T
OL
max and P
DD
/ I
and V
DD
OL
– V
A
and V
max + (P
DD
OH
I/O
J
, expressed in Watts. This is the maximum chip
max, in degrees Celsius, may be calculated
OH
) × I
max (P
/ I
OH
D
OH
),
max x Θ
D
of the I/Os at low and high level in the
max = P
STM32F205xx, STM32F207xx
JA
)
INT
Value
38
45
51
46
40
39
max + P
I/O
max),
°C/W
Unit