NB6L14MNG ON Semiconductor, NB6L14MNG Datasheet - Page 10

IC FANOUT BUFFER DIFF 1:4 16-QFN

NB6L14MNG

Manufacturer Part Number
NB6L14MNG
Description
IC FANOUT BUFFER DIFF 1:4 16-QFN
Manufacturer
ON Semiconductor
Series
ECLinPS MAX™r
Type
Fanout Buffer (Distribution)r
Datasheet

Specifications of NB6L14MNG

Number Of Circuits
1
Ratio - Input:output
1:4
Differential - Input:output
Yes/Yes
Input
CML, LVCMOS, LVDS, LVPECL, LVTTL
Output
LVCMOS, LVPECL
Frequency - Max
3GHz
Voltage - Supply
2.375 V ~ 3.63 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-TFQFN Exposed Pad
Frequency-max
3GHz
Number Of Outputs
8
Max Input Freq
3000 MHz
Propagation Delay (max)
0.5 ns @ 2.375V to 3.63V
Supply Voltage (max)
3.63 V
Supply Voltage (min)
2.375 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Supply Current
47 mA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
NB6L14MNG
NB6L14MNGOS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NB6L14MNG
Manufacturer:
ON
Quantity:
86
Part Number:
NB6L14MNG
Manufacturer:
ON
Quantity:
254
PUBLICATION ORDERING INFORMATION
ECLinPS MAX is a trademark of Semiconductor Components Industries, LLC (SCILLC).
LITERATURE FULFILLMENT:
16 X
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent
rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.
Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries,
affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury
or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an
Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
0.10 C
0.05 C
NOTE 5
16X
16X
LOCATION
0.10 C
0.08 C
0.15 C
K
L
PIN 1
0.15 C
NOTE 3
A B
DETAIL A
16X
Ç Ç Ç
Ç Ç Ç
b
4
1
DETAIL B
16
BOTTOM VIEW
SIDE VIEW
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
TOP VIEW
5
D2
D
13
8
(A3)
e
12
9
EXPOSED PAD
A1
e
A
B
E
E2
A
EXPOSED Cu
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
PACKAGE DIMENSIONS
C
SEATING
PLANE
L1
http://onsemi.com
CASE 485G−01
É É É É
É É
16 PIN QFN
ISSUE D
ALTERNATE TERMINAL
CONSTRUCTIONS
CONSTRUCTIONS
10
DETAIL B
MOLD CMPD
ALTERNATE
DETAIL A
L
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
A1
0.575
0.022
0.128
3.25
É É É É
Ç Ç
L
A3
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. L
0.012
0.30
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
MINIMUM SPACING BETWEEN LEAD TIP
AND FLAG
DIM
A1
A3
D2
max
E2
L1
A
D
E
K
b
e
L
0.128
3.25
CONDITION CAN NOT VIOLATE 0.2 MM
MILLIMETERS
MIN
0.80
0.00
0.18
1.65
1.65
0.30
0.00
0.20 REF
3.00 BSC
3.00 BSC
0.50 BSC
0.18 TYP
MAX
1.00
0.05
0.30
1.85
1.85
0.50
0.15
0.50
0.02
SCALE 10:1
EXPOSED PAD
0.059
1.50
NB6L14/D
0.012
0.30
inches
mm

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