NB6L14MNG ON Semiconductor, NB6L14MNG Datasheet - Page 5

• Manufacturer Part Number: NB6L14MNG
• Description: IC FANOUT BUFFER DIFF 1:4 16-QFN
• Manufacturer: ON Semiconductor
• Series: ECLinPS MAX™r
• Type: Fanout Buffer (Distribution)r

Specifications of NB6L14MNG

• Number Of Circuits: 1
• Ratio - Input:output: 1:4
• Differential - Input:output: Yes/Yes
• Input: CML, LVCMOS, LVDS, LVPECL, LVTTL
• Output: LVCMOS, LVPECL
• Frequency - Max: 3GHz
• Voltage - Supply: 2.375 V ~ 3.63 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TFQFN Exposed Pad
• Frequency-max: 3GHz
• Number Of Outputs: 8
• Max Input Freq: 3000 MHz
• Propagation Delay (max): 0.5 ns @ 2.375V to 3.63V
• Supply Voltage (max): 3.63 V
• Supply Voltage (min): 2.375 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Supply Current: 47 mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: NB6L14MNG; NB6L14MNGOS

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
9. Measured by forcing V
10. Input and output voltage swing is a single−ended measurement operating in differential mode.
11. Set−up and hold times apply to synchronous applications that intend to enable/disable before the next clock cycle. For asynchronous
12. Within device skew is measured between two different outputs under identical power supply, temperature and input conditions.
13. Device to device skew is measured between outputs under identical transition @ 0.5 GHz.
14. Additive RMS jitter with 50% duty cycle clock signal.
15. Additive peak−to−peak data dependent jitter with input NRZ data at PRBS 2
Table 6. AC CHARACTERISTICS
V
f
t
t
t
t
t
V
t
DATA
PD
S
H
SKEW
JITTER
r
,t
OUTPP
INPP
Symbol
40 ps (20%−80%).
applications, set−up and hold times do not apply.
f
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
Output Voltage Amplitude (@ V
Maximum Operating Data Rate
Propagation Delay
Set−Up Time (Note 11)
Hold Time (Note 11)
Within−Device Skew (Note 12)
Device to Device Skew (Note 13)
RMS Random Jitter (Note 14)
Peak−to−Peak Data Dependent Jitter
(Note 15)
Input Voltage Swing/Sensitivity
(Differential Configuration) (Note 10)
Output Rise/Fall Times @ Full Output Swing
(20%−80%)
INPP
(min) from a 50% duty cycle clock source. All loading with an external R
Figure 4. Output Voltage Amplitude (V
Characteristic
V
800
700
600
500
400
300
200
100
CC
Frequency at Ambient Temperature (Typical)
0
0
= 2.375 V to 3.63 V, GND = 0 V, T
INPPmin
1.25 GHz ≤ f
2.0 GHz ≤ f
f
out
) (Note 10)
, CLOCK OUTPUT FREQUENCY (GHz)
f
DATA
http://onsemi.com
f
IN
f
IN
in
in
EN to IN, IN
EN to IN, IN
≤ 1.25 GHz
= 2.5 Gb/s
≤ 2.0 GHz
≤ 3.0 GHz
= 2.5 GHz
1
IN to Q
5
A
^23
OUTPP
= −40°C to +85°C (Note 9)
Min
550
380
250
250
300
300
100
−1 and K28.5 at 2.5Gb/s.
70
2
) versus Output
Typ
700
500
320
370
150
2.5
5.0
14
L
= 50 W to V
3
V
CC
CC
– 2.0 V. Input edge rates
Max
500
150
200
1.0
20
− GND
Gb/s
Unit
mV
mV
ps
ps
ps
ps
ps
ps