ICS889834AKLF IDT, Integrated Device Technology Inc, ICS889834AKLF Datasheet - Page 9

• Manufacturer Part Number: ICS889834AKLF
• Description: IC CLOCK MULT HS 2-4 16-VFQFPN
• Manufacturer: IDT, Integrated Device Technology Inc
• Series: HiPerClockS™r
• Type: Fanout Buffer (Distribution), Multiplexerr

Specifications of ICS889834AKLF

• Number Of Circuits: 1
• Ratio - Input:output: 2:4
• Differential - Input:output: No/Yes
• Input: LVCMOS, LVTTL
• Output: ECL, LVPECL
• Frequency - Max: 1GHz
• Voltage - Supply: 2.375 V ~ 3.63 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-VFQFN
• Frequency-max: 1GHz
• Number Of Clock Inputs: 2
• Mode Of Operation: Single-Ended
• Output Frequency: >1000MHz
• Output Logic Level: ECL/LVPECL
• Operating Supply Voltage (min): -2.375/2.375V
• Operating Supply Voltage (typ): -2.5/-3.3/3.3V
• Operating Supply Voltage (max): -3.63/3.63V
• Package Type: VFQFN
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Signal Type: LVCMOS/LVTTL
• Mounting: Surface Mount
• Pin Count: 16
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 889834AKLF

This section provides information on power dissipation and junction temperature for the ICS889834.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS8889834 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θ
0 air flow and a multi-layer board, the appropriate value is 51.5°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
T
889834AK
ABLE
•
•
The equation for Tj is as follows: Tj = θ
Tj = Junction Temperature
θ
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
85°C + 0.275W * 51.5°C/W = 99.2°C. This is well below the limit of 125°C.
JA
A
Multi-Layer PCB, JEDEC Standard Test Boards
= Ambient Temperature
6. T
= Junction-to-Ambient Thermal Resistance
Power (core)
Power (outputs)
If all outputs are loaded, the total power is 4 * 27.83mW = 111.3mW
Total Power
HERMAL
Integrated
Circuit
Systems, Inc.
R
MAX
ESISTANCE
_MAX
MAX
= V
= 27.83mW/Loaded Output pair
(3.465, with all outputs switching) = 163.4mW + 111.3mW = 274.7mW
CC_MAX
θ θ θ θ θ
* I
JA
EE_MAX
FOR
θ θ θ θ θ
JA
P
CC
= 3.63V * 45mA = 163.4mW
16-
at 0 Airflow (Linear Feet per Minute)
JA
www.icst.com/products/hiperclocks.html
LVCMOS/LVTTL-
= 3.63V, which gives worst case results.
* Pd_total + T
OWER
PRELIMINARY
PIN
VFQFN, F
C
A
ONSIDERATIONS
ORCED
9
51.5°C/W
C
ONVECTION
TO
TM
-LVPECL/ECL C
devices is 125°C.
JA
must be used. Assuming a
L
LOCK
OW
ICS889834
S
M
KEW
REV. A MARCH 20, 2006
ULTIPLEXER
, 2-
TO
-4