PCF8593P,112 NXP Semiconductors, PCF8593P,112 Datasheet - Page 18

IC CLOCK/CALENDAR LOW PWR 8-DIP

PCF8593P,112

Manufacturer Part Number
PCF8593P,112
Description
IC CLOCK/CALENDAR LOW PWR 8-DIP
Manufacturer
NXP Semiconductors
Type
Clock/Calendar/NVSRAMr
Datasheet

Specifications of PCF8593P,112

Package / Case
8-DIP (0.300", 7.62mm)
Time Format
HH:MM:SS:hh (12/24 hr)
Date Format
YY-MM-DD-dd
Memory Size
8B
Interface
I²C, 2-Wire Serial
Voltage - Supply
1 V ~ 6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Through Hole
Function
Clock/Calendar/Alarm/Timer Interrupt
Rtc Memory Size
8 Byte
Supply Voltage (max)
6 V
Supply Voltage (min)
1 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
Through Hole
Rtc Bus Interface
Serial (I2C)
Bus Type
Serial (I2C)
User Ram
8Byte
Package Type
PDIP
Operating Supply Voltage (max)
6V
Operating Temperature Classification
Industrial
Operating Temperature (max)
85C
Operating Temperature (min)
-40C
Pin Count
8
Mounting
Through Hole
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-1089-5
935151750112
PCF8593N
NXP Semiconductors
9. Limiting values
PCF8593
Product data sheet
Table 6.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
[4]
Symbol
V
I
I
V
I
I
P
P
V
T
T
I
DD
SS
I
O
lu
stg
amb
DD
I
tot
o
ESD
Pass level; Human Body Model (HBM), according to
Pass level; Machine Model (MM), according to
Pass level; latch-up testing according to
According to the NXP store and transport requirements (see
stored at a temperature of +8 °C to +45 °C and a humidity of 25 % to 75 %. For long term storage products
deviant conditions are described in that document.
Parameter
supply voltage
supply current
ground supply current
input voltage
input current
output current
total power dissipation
output power
electrostatic discharge
voltage
latch-up current
storage temperature
ambient temperature
Limiting values
All information provided in this document is subject to legal disclaimers.
Rev. 04 — 6 October 2010
Conditions
HBM
MM
operating device
Ref. 7 “JESD78”
Ref. 6
Ref. 5
“JESD22-A115”.
at maximum ambient temperature (T
“JESD22-A114”.
Ref. 9
Low power clock and calendar
“NX3-00092”) the devices have to be
[1]
[2]
[3]
[4]
Min
−0.8
-
-
−0.8
-
-
-
-
-
-
-
−65
−40
PCF8593
© NXP B.V. 2010. All rights reserved.
Max
+0.7
50
50
V
10
10
300
50
±3000
±300
100
+150
+85
DD
+ 0.8
amb(max)
18 of 35
Unit
V
mA
mA
V
mA
mA
mW
mW
V
V
mA
°C
°C
).

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