DS1342U+ Maxim Integrated Products, DS1342U+ Datasheet - Page 2

• Manufacturer Part Number: DS1342U+
• Description: IC RTC I2C W/ALARM 8USOP
• Manufacturer: Maxim Integrated Products
• Type: Clock/Calendar/Alarmr

Specifications of DS1342U+

• Time Format: HH:MM:SS (12/24 hr)
• Date Format: YY-MM-DD-dd
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Memory Size: -

Low-Current I
ABSOLUTE MAXIMUM RATINGS
Voltage Range on Any Pin Relative to Ground ....-0.3V to +6.0V
Operating Temperature Range .......................... -40NC to +85NC
Junction Temperature Maximum .....................................+150NC
PACKAGE THERMAL CHARACTERISTICS (Note 1)
FSOP
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
2
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(V
Operating Voltage Range
Minimum Timekeeping Voltage
Timekeeping Current: DS1341
CLKIN = GND or CLKIN = V
(Note 4)
Timekeeping Current: DS1342
CLKIN = GND or CLKIN = V
(Note 4)
Logic 1 Input
Logic 0 Input
Input Leakage
(SCL, CLKIN/INTA)
Output Leakage
(CLKIN/INTA, SQW/INTB)
Output Logic 1
V
Output Logic 0
V
SQW/INTB)
CC
Junction-to-Ambient Thermal Resistance (B
Junction-to-Case Thermal Resistance (B
OH
OL
= +0.4V (SDA, CLKIN/INTA,
= +1.8V to +5.5V, T
= +1.0V (SQW /INTB)
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
A
= -40NC to +85NC, unless otherwise noted.) (Note 2)
CC
CC
SYMBOL
V
2
CCTMIN
V
I
I
V
I
CCT
CCT
V
I
V
CCT
OH
C RTCs for High-ESR Crystals
I
I
OL
CC
LI
O
IH
IL
JC
) ...............42NC/W
JA
) .....206.3NC/W
Full operation (Note 3)
Timekeeping (Notes 3, 4)
T
V
V
V
V
V
V
V
V
(Note 2)
(Note 2)
ECLK = 1, V
ECLK = A1IE = A2IE = 0
V
V
V
V
A
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
= +25NC (Notes 3, 4)
= +3.0V, EGFIL = 0, DOSF = 1
= +5.5V
= +3.0V, EGFIL = 1, DOSF = 0
= +5.5V
= +3.0V, EGFIL = 0, DOSF = 1
= +5.5V
= +3.0V, EGFIL = 1, DOSF = 0
= +5.5V
R 1.8V, INTCN = 0
R 1.3V, INTCN = 0
R 1.8V
R 1.3V (Note 5)
IN
CONDITIONS
= 0V to V
Storage Temperature Range ............................ -55NC to +125NC
Lead Temperature (soldering, 10s) ................................+260NC
Soldering Temperature (reflow) ......................................+260NC
TDFN
Junction-to-Ambient Thermal Resistance (B
Junction-to-Case Thermal Resistance (B
CC
0.7 x
-250
V
MIN
-0.3
-0.1
-1.0
-3.0
250
1.8
1.3
3.0
CC
TYP
1.15
220
250
280
320
250
280
310
350
JC
) .................8NC/W
V
JA
MAX
0.3 x
+0.1
+1.0
V
500
600
560
700
600
700
660
800
CC
5.5
5.5
1.3
0.3
CC
) ..........41NC/W
+
UNITS
mA
mA
nA
nA
FA
FA
FA
FA
V
V
V
V