MT47H64M16HR-3:H TR Micron Technology Inc, MT47H64M16HR-3:H TR Datasheet - Page 21

• Manufacturer Part Number: MT47H64M16HR-3:H TR
• Manufacturer: Micron Technology Inc

Specifications of MT47H64M16HR-3:H TR

• Lead Free Status / Rohs Status: Compliant

Figure 10: 60-Ball FBGA (8mm x 10mm) – x4, x8
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. V 6/10 EN
10 ±0.1
60X Ø0.45
Dimensions
apply to solder
balls post-reflow
on Ø0.35 SMD
ball pads.
8 CTR
0.8 TYP
0.155
Notes:
9
1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or leaded Eutectic (62% Sn,
8
Nonconductive
36%Pb, 2% Ag).
7
overmold
1.8 CTR
6.4 CTR
8 ±0.1
0.8 TYP
3
2
1
B
C
D
E
F
G
H
K
L
A
J
21
A
Ball A1 ID
Exposed gold plated pad
1.0 MAX X 0.7 nominal.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Seating plane
0.12 A
1Gb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.1 ±0.1
© 2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging