MT18HTF25672PY-667G1 Micron Technology Inc, MT18HTF25672PY-667G1 Datasheet - Page 2
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MT18HTF25672PY-667G1
Manufacturer Part Number
MT18HTF25672PY-667G1
Description
Manufacturer
Micron Technology Inc
Datasheet
1.MT18HTF25672PY-667G1.pdf
(18 pages)
Specifications of MT18HTF25672PY-667G1
Main Category
DRAM Module
Sub-category
DDR2 SDRAM
Module Type
240RDIMM
Device Core Size
72b
Organization
256Mx72
Total Density
2GByte
Chip Density
1Gb
Access Time (max)
45ps
Maximum Clock Rate
667MHz
Operating Supply Voltage (typ)
1.8V
Operating Current
2.43A
Number Of Elements
18
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Pin Count
240
Mounting
Socket
Lead Free Status / Rohs Status
Compliant
Table 2:
Table 3:
Table 4:
Table 5:
PDF: 09005aef80e5e752/Source: 09005aef80e5e626
HTF18C64_128_256x72.fm - Rev. E 3/07 EN
Refresh count
Row address
Device bank address
Device page size per bank
Device configuration
Column address
Module rank address
MT18HTF12872(P)Y-80E__
MT18HTF12872(P)Y-800__
MT18HTF12872(P)Y-667__
MT18HTF12872(P)Y-53E__
MT18HTF12872(P)Y-40E__
MT18HTF25672(P)Y-80E__
MT18HTF25672(P)Y-800__
MT18HTF25672(P)Y-667__
MT18HTF25672(P)Y-53E__
MT18HTF25672(P)Y-40E__
MT18HTF6472Y-53E__
MT18HTF6472Y-40E__
Part Number
Part Number
Part Number
Addressing
Part Numbers and Timing Parameters – 512MB Modules
Base device: MT47H64M4,
Part Numbers and Timing Parameters – 1GB Modules
Base device: MT47H128M4,
Part Numbers and Timing Paramters – 2GB Modules
Base device: MT47H256M4,
Notes:
2
2
2
1. Data sheets for the base devices can be found on Micron’s Web site.
2. All part numbers end with a two-place code (not shown), designating component and PCB
revisions. Consult factory for current revision codes. Example: MT18HTF6472Y-667D2.
Module
Density
Module
Density
Module
Density
512MB
512MB
1GB
1GB
1GB
1GB
1GB
2GB
2GB
2GB
2GB
2GB
512MB, 1GB, 2GB (x72, ECC, SR) 240-Pin DDR2 SDRAM RDIMM
1
1
1
256Mb DDR2 SDRAM
512Mb DDR2 SDRAM
1Gb DDR2 SDRAM
Configuration
Configuration
Configuration
128 Meg x 72
128 Meg x 72
128 Meg x 72
128 Meg x 72
128 Meg x 72
64 Meg x 72
64 Meg x 72
256 Meg x 72
256 Meg x 72
256 Meg x 72
256 Meg x 72
256 Meg x 72
256Mb (64 Meg x 4)
2K (A0–A9, A11)
8K (A0–A12)
4 (BA0, BA1)
512MB
1 (S0#)
2
1KB
8K
Bandwidth
Bandwidth
Bandwith
Module
4.3 GB/s
3.2 GB/s
Module
6.4 GB/s
6.4 GB/s
5.3 GB/s
4.3 GB/s
3.2 GB/s
Module
6.4 GB/s
6.4 GB/s
5.3 GB/s
4.3 GB/s
3.2 GB/s
Micron Technology, Inc., reserves the right to change products or specifications without notice.
512Mb (128 Meg x 4)
2K (A0–A9, A11)
16K (A0–A13)
4 (BA0, BA1)
Memory Clock/
3.75ns/533 MT/s
Memory Clock/
5.0ns/400 MT/s
3.75ns/533 MT/s
Memory Clock/
1 (S0#)
3.75ns/533 MT/s
2.5ns/800 MT/s
2.5ns/800 MT/s
3.0ns/667 MT/s
5.0ns/400 MT/s
2.5ns/800 MT/s
2.5ns/800 MT/s
3.0ns/667 MT/s
5.0ns/400 MT/s
1GB
1KB
Data Rate
8K
Data Rate
Data Rate
©2003 Micron Technology, Inc. All rights reserved.
1Gb (256 Meg x 4)
8 (BA0, BA1, BA2)
2K (A0–A9, A11)
16K (A0–A13)
(CL-
(CL-
(CL-
1 (S0#)
Latency
Latency
2GB
Latency
1KB
t
8K
t
4-4-4
3-3-3
t
RCD-
5-5-5
6-6-6
5-5-5
4-4-4
3-3-3
RCD-
5-5-5
6-6-6
5-5-5
4-4-4
3-3-3
Features
RCD-
t
t
t
RP)
RP)
RP)