SC2200UFH-266B D3 AMD (ADVANCED MICRO DEVICES), SC2200UFH-266B D3 Datasheet - Page 427
SC2200UFH-266B D3
Manufacturer Part Number
SC2200UFH-266B D3
Description
Manufacturer
AMD (ADVANCED MICRO DEVICES)
Datasheet
1.SC2200UFH-266B_D3.pdf
(429 pages)
Specifications of SC2200UFH-266B D3
Operating Temperature (min)
0C
Operating Temperature (max)
85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Lead Free Status / Rohs Status
Not Compliant
- Current page: 427 of 429
- Download datasheet (4Mb)
Appendix A: Support Documentation
A.1
1.
2.
AMD Geode™ SC2200 Processor Data Book
Ordering Part Number
(AMD OPN)
SC2200UFH-233
SC2200UFH-233F
SC2200UFH-266
SC2200UFH-266F
SC2200UFH-266B
SC2200UFH-266BF
SC2200UFH-300
SC2200UFH-300F
The “F” suffix denotes the Pb-free (lead-free) package. See Section 10.0 on page 443 for the BGU481 (481-terminal
Ball Grid Array Cavity Up) package specification.
The “B” suffix denotes a maximum I
Table 9-7 on page 373 for details.
Consult your local AMD sales office to confirm availability of specific valid combinations and to check on newly released
combinations possibly not listed.
Order Information
1
Appendix
Frequency
BAT
(MHz)
Core
233
266
300
current of 15 µA. Non-B parts have a maximum I
ASupport Documentation
(V
Voltage
Core
1.8V
1.8V
2.1V
CORE
)
(Degree C)
Temp.
0 - 85
0 - 85
0 - 85
32580B
Package
BGU481
BGU481 Pb-free
BGU481
BGU481 Pb-free
BGU481
BGU481 Pb-free
BGU481
BGU481 Pb-free
BAT
current of 50 µA. Refer to
2
447
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