934055687215 NXP Semiconductors, 934055687215 Datasheet

934055687215

Manufacturer Part Number
934055687215
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of 934055687215

Configuration
Dual Series
Forward Current
50mA
Forward Voltage
1.1V
Power Dissipation
250mW
Operating Temperature Classification
Military
Reverse Voltage
50V
Mounting
Surface Mount
Maximum Series Resistance @ Minimum If
40@0.5mAOhm
Maximum Series Resistance @ Maximum If
5@10mAOhm
Typical Carrier Life Time
1.05us
Operating Temperature (max)
150C
Operating Temperature (min)
-65C
Pin Count
3
Lead Free Status / Rohs Status
Compliant
Product specification
Supersedes data of 1999 May 10
DATA SHEET
BAP50-04
General purpose PIN diode
ok, halfpage
DISCRETE SEMICONDUCTORS
M3D088
1999 Dec 03

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934055687215 Summary of contents

Page 1

DATA SHEET ok, halfpage BAP50-04 General purpose PIN diode Product specification Supersedes data of 1999 May 10 DISCRETE SEMICONDUCTORS M3D088 1999 Dec 03 ...

Page 2

... NXP Semiconductors General purpose PIN diode FEATURES  Two elements in series configuration in a small-sized plastic SMD package  Low diode capacitance  Low diode forward resistance. APPLICATIONS  General RF applications. DESCRIPTION Two planar PIN diodes in series configuration in an SOT23 small plastic SMD package. ...

Page 3

... NXP Semiconductors General purpose PIN diode ELECTRICAL CHARACTERISTICS = 25 C unless otherwise specified SYMBOL PARAMETER Per diode V forward voltage F V reverse voltage R I reverse current R C diode capacitance d diode forward resistance r D  charge carrier life time L L series inductance S Note 1. Guaranteed on AQL basis: inspection level S4, AQL 1.0. ...

Page 4

... NXP Semiconductors General purpose PIN diode GRAPHICAL DATA 3 10 handbook, halfpage r D (Ω −2 −  100 MHz Fig.2 Forward resistance as a function of the forward current; typical values. 0 handbook, halfpage (dB) −1 −2 −3 −4 −5 0.5 1 1.5 ( mA Diode inserted in series with a 50  stripline circuit and biased via the analyzer Tee network  ...

Page 5

... NXP Semiconductors General purpose PIN diode PACKAGE OUTLINE Plastic surface-mounted package; 3 leads DIMENSIONS (mm are the original dimensions UNIT max. 1.1 0.48 0.15 mm 0.1 0.9 0.38 0.09 OUTLINE VERSION IEC SOT23 1999 Dec scale 3.0 1.4 2.5 1.9 0.95 2.8 1.2 2.1 ...

Page 6

... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the ...

Page 7

... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...

Page 8

... Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. ...

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