MT4JSF12864HZ-1G1D1 Micron Technology Inc, MT4JSF12864HZ-1G1D1 Datasheet

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MT4JSF12864HZ-1G1D1

Manufacturer Part Number
MT4JSF12864HZ-1G1D1
Description
MOD DDR3 SDRAM 1GB 200SODIMM
Manufacturer
Micron Technology Inc
Series
-r
Datasheet

Specifications of MT4JSF12864HZ-1G1D1

Main Category
DRAM Module
Sub-category
DDR3 SDRAM
Module Type
SODIMM
Device Core Size
64b
Organization
128Mx64
Total Density
1GByte
Maximum Clock Rate
1.066GHz
Operating Supply Voltage (typ)
1.5V
Operating Current
840mA
Number Of Elements
4
Operating Supply Voltage (max)
1.575V
Operating Supply Voltage (min)
1.425V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Pin Count
204
Mounting
Socket
Memory Type
DDR3 SDRAM
Memory Size
1GB
Speed
1066MT/s
Features
-
Package / Case
200-SODIMM
Lead Free Status / Rohs Status
Supplier Unconfirmed
DDR3 SDRAM SODIMM
MT4JSF6464HZ – 512MB
MT4JSF12864HZ – 1GB
Features
• DDR3 functionality and operations supported as de-
• 204-pin, small-outline dual in-line memory module
• Fast data transfer rates: PC3-12800, PC3-10600,
• 512MB (64 Meg x 64), 1GB (128 Meg x 64)
• V
• V
• Nominal and dynamic on-die termination (ODT) for
• Single rank
• On-board I
• 8 internal device banks
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
• Selectable BC4 or BL8 on-the-fly (OTF)
• Gold edge contacts
• Halogen-free
• Fly-by topology
• Terminated control, command, and address bus
Table 1: Key Timing Parameters
PDF: 09005aef83b05507
jsf4c64_128x64hz.pdf - Rev. B 3/10
Speed
Grade
fined in the component data sheet
(SODIMM)
PC3-8500, or PC3-6400
data, strobe, and mask signals
rial presence-detect (SPD) EEPROM
via the mode register set (MRS)
-1G6
-1G4
-1G1
-1G0
-80C
-80B
DD
DDSPD
= 1.5V ±0.075V
= +3.0V to +3.6V
Nomenclature
PC3-12800
PC3-10600
2
Industry
PC3-8500
PC3-8500
PC3-6400
PC3-6400
C temperature sensor with integrated se-
Products and specifications discussed herein are subject to change by Micron without notice.
CL = 11 CL = 10
1600
1333
1333
CL = 9
1333
1333
Data Rate (MT/s)
512MB, 1GB (x64, SR) 204-Pin DDR3 SODIMM
CL = 8
1066
1066
1066
1066
1
Figure 1: 204-Pin SODIMM (MO-268 R/C C)
Options
• Operating temperature
• Package
• Frequency/CAS latency
Module Height: 30mm (1.18 in)
– Commercial (0°C ≤ T
– 204-pin DIMM (halogen-free)
– 1.25ns @ CL = 11(DDR3-1600)
– 1.5ns @ CL = 9 (DDR3-1333)
– 1.87ns @ CL = 7 (DDR3-1066)
CL = 7
1066
1066
1066
Micron Technology, Inc. reserves the right to change products or specifications without notice.
CL = 6
800
800
800
800
800
800
CL = 5
667
667
667
667
800
667
A
≤ +70°C)
© 2009 Micron Technology, Inc. All rights reserved.
13.125
13.125
13.125
t
(ns)
12.5
RCD
15
15
13.125
13.125
13.125
(ns)
12.5
t
15
15
RP
Marking
Features
None
-1G6
-1G4
-1G1
Z
48.125
49.125
50.625
(ns)
52.5
52.5
t
50
RC

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MT4JSF12864HZ-1G1D1 Summary of contents

Page 1

... DDR3 SDRAM SODIMM MT4JSF6464HZ – 512MB MT4JSF12864HZ – 1GB Features • DDR3 functionality and operations supported as de- fined in the component data sheet • 204-pin, small-outline dual in-line memory module (SODIMM) • Fast data transfer rates: PC3-12800, PC3-10600, PC3-8500, or PC3-6400 • 512MB (64 Meg x 64), 1GB (128 Meg x 64) • ...

Page 2

... The data sheet for the base device can be found on Micron’s Web site. Notes: 2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Con- sult factory for current revision codes. Example: MT4JSF12864HZ-1G1D1. PDF: 09005aef83b05507 jsf4c64_128x64hz.pdf - Rev. B 3/10 ...

Page 3

Pin Assignments and Descriptions Table 5: Pin Assignments 204-Pin DDR3 SODIMM Front Pin Symbol Pin Symbol Pin DQ19 105 REFDQ 107 DQ0 57 DQ24 109 7 DQ1 59 DQ25 111 ...

Page 4

Table 6: Pin Descriptions Symbol Type Description A[13:0] Input Address inputs: Provide the row address for ACTIVATE commands, and the column ad- dress and auto precharge bit (A10) for READ/WRITE commands, to select one location out of the memory array ...

Page 5

... Termination voltage: Used for control, command, and address (V TT – connect: These pins are not connected on the module. – function: Connected within the module, but provides no functionality. PDF: 09005aef83b05507 jsf4c64_128x64hz.pdf - Rev. B 3/10 512MB, 1GB (x64, SR) 204-Pin DDR3 SODIMM Pin Assignments and Descriptions /2 Micron Technology, Inc ...

Page 6

... DQ Map Table 7: Component-to-Module DQ Map Component Reference Component Number DQ Module PDF: 09005aef83b05507 jsf4c64_128x64hz.pdf - Rev. B 3/10 512MB, 1GB (x64, SR) 204-Pin DDR3 SODIMM Component Module Pin Reference Number Number 140 U4 37 132 39 142 33 131 34 141 32 129 35 143 36 130 41 149 47 160 44 146 43 159 45 148 42 157 ...

Page 7

Functional Block Diagram Figure 2: Functional Block Diagram S0# DQS# DQS0# DQS DQS0 DM DM0 DQ0 DQ DQ1 DQ DQ2 DQ DQ3 DQ DQ4 DQ DQ5 DQ DQ6 DQ DQ7 DQ DQS# DQS1# DQS DQS1 DM DM1 DQ8 DQ DQ9 ...

Page 8

... DRAM core and eight corresponding n-bit-wide, one-half-clock-cycle data trans- fers at the I/O pins. DDR3 modules use two sets of differential signals: DQS, DQS# to capture data and CK and CK# to capture commands, addresses, and control signals. Differential clocks and data strobes ensure exceptional noise immunity for these signals and provide precise crossing points to capture input signals ...

Page 9

... Electrical Specifications Stresses greater than those listed may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other condi- tions outside those indicated in each device’s data sheet is not implied. Exposure to absolute maximum rating conditions for extended periods may adversely affect reliability. ...

Page 10

... Component specifications are available on Micron’s Web site. Module speed grades cor- relate with component speed grades, as shown below. Table 10: Module and Component Speed Grades DDR3 components may exceed the listed module speed grades; module may not be available in all listed speed grades Module Speed Grade -1G6 ...

Page 11

I Specifications DD Table 11: DDR3 I Specifications and Conditions – 512MB DD Values are for the MT41J64M16 DDR3 SDRAM only and are computed from values specified in the 1Gb (64 Meg x 16) component data sheet Parameter Operating current ...

Page 12

Table 12: DDR3 I Specifications and Conditions – 1GB DD Values are for the MT41J128M16 DDR3 SDRAM only and are computed from values specified in the 2Gb (128 Meg x 16) component data sheet Parameter Operating current 0: One bank ...

Page 13

... TSE2002av, Serial Presence Detect with Temperature Sensor.” Serial Presence-Detect EEPROM Operation DDR3 SDRAM modules incorporate serial presence-detect. The SPD data is stored in a 256-byte EEPROM. The first 128 bytes are programmed by Micron to comply with JE- DEC standard JC-45, “Appendix X: Serial Presence Detect (SPD) for DDR3 SDRAM Modules.” ...

Page 14

Table 14: Sensor and EEPROM Serial Interface Timing (Continued) Parameter/Condition Start condition setup time Stop condition setup time EVENT# Pin The temperature sensor also adds the EVENT# pin (open drain). Not used by the SPD EEPROM, EVENT temperature ...

Page 15

Figure 3: EVENT# Pin Functionality Critical Alarm window (MAX) Alarm window (MIN) EVENT# interrupt mode EVENT# comparator mode EVENT# critical temperature only mode Table 15: Temperature Sensor Registers Name Pointer register Capability register Configuration register Alarm temperature upper boundary register ...

Page 16

Table 16: Pointer Register Bits 0– Table 17: Pointer Register Bits 0–2 Descriptions Capability Register The capability register indicates the features and functionality supported by the temper- ature sensor. ...

Page 17

Table 19: Capability Register Bit Description (Continued) Bit Description 4:3 Temperature resolution 00: 0.5°C LSB 01: 0.25°C LSB 10: 0.125°C LSB 11: 0.0625°C LSB 15:5 0: Must be set to zero Configuration Register Table 20: Configuration Register (Address: 0x01) 15 ...

Page 18

Table 21: Configuration Register Bit Descriptions (Continued) Bit Description 6 Alarm window lock bit 0: Alarm trips are not locked and can be changed 1: Alarm trips are locked and cannot be changed 7 Critical trip lock bit 0: Critical ...

Page 19

Figure 4: Hysteresis Applied to Temperature Around Trip Points Below window bit Above window bit 1. T Notes Hyst is the value set in the hysteresis bits of the configuration register. Table 22: Hysteresis Applied to Alarm ...

Page 20

Temperature Trip Point Registers The upper and lower temperature boundary registers are used to set the maximum and minimum values of the alarm window. LSB for these registers is 0.25°C. All RFU bits in the register will always report zero. ...

Page 21

Table 26: Temperature Register (Address: 0x05 Above Above Below MSB critical alarm alarm trip window window Table 27: Temperature Register Bit Descriptions Bit Description 13 Below alarm window 0: Temperature is equal to or above the lower ...

Page 22

... 1.0 (0.039) 0.45 (0.018) 0.60 (0.024) TYP TYP PIN 1 63.60 (2.504) TYP Back view No Components This Side of Module 3.0 (0.12) 39.0 (1.535) 21.0 (0.827) TYP 24.8 (0.976) times occur. 22 Module Dimensions 30.15 (1.187) U4 29.85 (1.175) 20.0 (0.787) TYP ...

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