PPC5561MVZ132 Freescale Semiconductor, PPC5561MVZ132 Datasheet - Page 8

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PPC5561MVZ132

Manufacturer Part Number
PPC5561MVZ132
Description
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of PPC5561MVZ132

Lead Free Status / Rohs Status
Supplier Unconfirmed
Electrical Characteristics
so that the thermocouple junction rests on the package. Place a small amount of epoxy on the thermocouple
junction and approximately 1 mm of wire extending from the junction. Place the thermocouple wire flat
against the package case to avoid measurement errors caused by the cooling effects of the thermocouple
wire.
References:
Semiconductor Equipment and Materials International
805 East Middlefield Rd.
Mountain View, CA., 94043
(415) 964-5111
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at
800-854-7179 or 303-397-7956.
JEDEC specifications are available on the web at http://www.jedec.org.
3.3
The MPC5561 is available in packaged form. Read the package options in
Information.”
3.4
1
2
3
8
Spec
EMI testing and I/O port waveforms per SAE J1752/3 issued 1995-03. Qualification testing was performed on the MPC5554
and applied to the MPC5500 family as generic EMI performance data.
Measured with the single-chip EMI program.
Measured with the expanded EMI program.
1
2
3
4
5
6
7
Scan range
Operating frequency
V
V
V
Maximum amplitude
Operating temperature
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an
Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
2. G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled
Applications,” Electronic Packaging and Production, pp. 53–58, March 1998.
3. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance
and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999,
pp. 212–220.
DD
DDSYN
PP
, V
Package
EMI (Electromagnetic Interference) Characteristics
operating voltages
DDEH
, V
Refer to
RC33
, V
DDA
, V
DD33
operating voltages
Section 4, “Mechanicals,”
Characteristic
, V
FLASH
, V
MPC5561 Microcontroller Data Sheet, Rev. 2.0
Table 4. EMI Testing Specifications
DDE
operating voltages
for pinouts and package drawings.
Minimum
0.15
1
Typical
1.5
3.3
5.0
Section 2, “Ordering
Freescale Semiconductor
Maximum
1000
f
14
32
MAX
25
2
3
dBuV
MHz
MHz
Unit
o
V
V
V
C