MT36HTS1G72PY-667A1 Micron Technology Inc, MT36HTS1G72PY-667A1 Datasheet - Page 7

• Manufacturer Part Number: MT36HTS1G72PY-667A1
• Manufacturer: Micron Technology Inc

Specifications of MT36HTS1G72PY-667A1

• Main Category: DRAM Module
• Sub-category: DDR2 SDRAM
• Module Type: 240RDIMM
• Device Core Size: 72b
• Organization: 1Gx72
• Total Density: 8GByte
• Access Time (max): 45ps
• Maximum Clock Rate: 667MHz
• Operating Supply Voltage (typ): 1.8V
• Operating Current: 3.294A
• Number Of Elements: 36
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Pin Count: 240
• Mounting: Socket
• Lead Free Status / Rohs Status: Compliant

Electrical Specifications
Table 8:
Input Capacitance
AC Timing and Operating Conditions
Table 9:
PDF: 09005aef822553c2/Source: 09005aef822553af
HTJ_S36C512_1Gx72.fm - Rev. F 5/07 EN
V
V
Symbol
DD
IN
I
VREF
, V
T
I
/V
T
OZ
I
C
A
I
1
DD
OUT
Q
Absolute Maximum Ratings
Module and Component Speed Grades
Parameter
V
Voltage on any pin relative to V
Input leakage current; Any input 0V ≤ V
V
test = 0V)
Output leakage current; 0V ≤ V
ODT are disabled
V
Module ambient operating temperature
DDR2 SDRAM component case operating
temperature
REF
REF
DD
/V
Module Speed Grade
Notes:
input 0V ≤ V
leakage current; V
DD
Q supply voltage relative to V
2
Stresses greater than those listed in Table 8, may cause permanent damage to the
module. This is a stress rating only, and functional operation of the module at these or
any other conditions above those indicated in each device's data sheet is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect reli-
ability.
1. The refresh rate is required to double when 85°C < T
2. For further information, refer to technical note
Micron encourages designers to simulate the performance of the module to achieve
optimum values. Simulations are significantly more accurate and realistic than a gross
estimation of module capacitance when inductance and delay parameters associated
with trace lengths are used in simulations. JEDEC modules are currently designed using
simulations to close timing budgets.
Recommended AC operating conditions are given in the DDR2 component data sheets.
Component specifications are available on Micron’s Web
correlate with component speed grades as shown in Table 9.
-667
-53E
-40E
IN
on Micron’s Web site.
≤ 0.95V (All other pins not under
REF
= valid V
OUT
SS
4GB, 8GB (x72, ECC, DR) 240-Pin DDR2 SDRAM RDIMM
≤ V
REF
SS
DD
level
IN
Q; DQs and
≤ V
DD
7
;
Address inputs
RAS#, CAS#, WE#, S#,
CKE, ODT, BA
CK, CK#
DM
DQ, DQS, DQS#
Commercial
Industrial
Commercial
Industrial
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Component Speed Grade
TN-00-08: Thermal
C
≤ 95°C.
Electrical Specifications
site.
-37E
-5E
-3
–250
Module speed grades
Min
–0.5
–0.5
©2003 Micron Technology, Inc. All rights reserved.
–10
–10
–10
–72
–40
–40
0
0
Applications, available
+250
Max
+2.3
+2.3
+10
+10
+10
+72
+70
+85
+85
+95
Units
µA
µA
µA
°C
°C
°C
°C
V
V