DSPB56371AF150 Freescale Semiconductor, DSPB56371AF150 Datasheet - Page 35

• Manufacturer Part Number: DSPB56371AF150
• Description: IC DSP 24BIT 150MHZ 80-LQFP
• Manufacturer: Freescale Semiconductor
• Series: Symphony™r
• Type: Audio Processorr

Specifications of DSPB56371AF150

• Interface: Host Interface, I²C, SAI, SPI
• Clock Rate: 150MHz
• Non-volatile Memory: ROM (384 kB)
• On-chip Ram: 264kB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.25V
• Operating Temperature: -40°C ~ 115°C
• Mounting Type: Surface Mount
• Package / Case: 80-LQFP
• Product: DSPs
• Data Bus Width: 24 bit
• Processor Series: DSP563xx
• Core: 56000
• Numeric And Arithmetic Format: Fixed-Point
• Device Million Instructions Per Second: 150 MIPs
• Maximum Clock Frequency: 150 MHz
• Program Memory Size: 192 KB
• Data Ram Size: 264 KB
• Operating Supply Voltage: 1.25 V, 3.3 V
• Maximum Operating Temperature: + 115 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

6
7
Freescale Semiconductor
Supply voltages
Supply voltages
Input high voltage
Note: All 3.3 V supplies must rise prior to the rise of the 1.25 V supplies to avoid a high current condition and
possible system damage.
Input low voltage
Input leakage current (All pins)
Clock pin Input Capacitance (EXTAL)
High impedance (off-state) input current
(@ 3.46 V)
Output high voltage
Output low voltage
Internal supply current
181MHz
• Core (core_vdd)
• PLL (plld_vdd)
• Vio_vdd
• PLL (pllp_vdd)
• PLL (plla_vdd)
• All pins
• All pins
• In Normal mode
I
I
Natural Convection, Junction-to-ambient thermal
resistance
Junction-to-case thermal resistance
Note:
OH
OL
= 5 mA
Thermal Characteristics
DC Electrical Characteristics
= -5 mA
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
SPEC-883 Method 1012.1).
1,2
Characteristics
Characteristic
1
at internal clock of
Table 16. DC ELECTRICAL CHARACTERISTICS
Table 15. Thermal Characteristics
3
DSP56371 Data Sheet, Rev. 4.1
Symbol
V
V
V
V
I
V
C
I
DDIO
V
I
CCI
TSI
OH
DD
IN
OL
IH
IN
IL
R
R
Symbol
θJC
θJA
–0.3
Min
3.14
–84
1.2
2.0
2.4
—
—
—
or θ
or θ
JA
JC
3.749
1.25
TQFP Value
Typ
3.3
99
—
—
—
—
—
—
18.25
39
4
V
IO_VDD+2V
Thermal Characteristics
3.46
Max
1.3
200
0.8
0.4
84
84
—
1
1
°
°
Unit
C/W
C/W
Unit
mA
µA
pF
µA
V
V
V
V
V
V
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