CY7C64714-100AXC Cypress Semiconductor Corp, CY7C64714-100AXC Datasheet - Page 49

• Manufacturer Part Number: CY7C64714-100AXC
• Description: IC MCU USB EZ FX1 16KB 100LQFP
• Manufacturer: Cypress Semiconductor Corp
• Series: EZ-USB FX1™r

Specifications of CY7C64714-100AXC

• Applications: USB Microcontroller
• Core Processor: 8051
• Program Memory Type: ROMless
• Controller Series: CY7C647xx
• Ram Size: 16K x 8
• Interface: I²C, USB, USART
• Number Of I /o: 40
• Voltage - Supply: 3.15 V ~ 3.45 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Purchase of I
I
as defined by Philips. EZ-USB FX1, EZ-USB FX2LP, EZ-USB FX2, and ReNumeration are trademarks, and EZ-USB is a registered
trademark, of Cypress Semiconductor. All product and company names mentioned in this document are the trademarks of their
respective holders.
Document #: 38-08039 Rev. *C
© Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
2
C Patent Rights to use these components in an I
2
C components from Cypress, or one of its sublicensed Associated Companies, conveys a license under the Philips
Via hole for thermally connecting the
QFN to the circuit board ground plane.
Figure 13-1. Cross-section of the Area Underneath the QFN Package
PCB Material
Figure 13-2. Plot of the Solder Mask (White Area)
Figure 13-3. X-ray Image of the Assembly
2
Cu Fill
C system, provided that the system conforms to the I
Solder Mask
0.013” dia
0.017” dia
This figure only shows the top three layers of the
circuit board: Top Solder, PCB Dielectric, and
the Ground Plane
Cu Fill
PCB Material
2
C Standard Specification
CY7C64713/14
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