LE80538VE0041M Intel, LE80538VE0041M Datasheet - Page 65

• Manufacturer Part Number: LE80538VE0041M
• Description: IC PROC CELERON M 1.06GHZ 479BGA
• Manufacturer: Intel

Specifications of LE80538VE0041M

• Processor Type: Celeron M
• Features: 533MHZ Bus, 1M L2 Cache
• Speed: 1.06GHz
• Voltage: 0.94V
• Mounting Type: Surface Mount
• Package / Case: 479-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 883549

5.1
5.1.1
Intel
®
Table 27. Thermal Diode Interface
Table 28. Thermal Diode Specifications
Celeron
Note: The reading of the external thermal sensor (on the motherboard) connected to the processor
®
M Processor Datasheet
Thermal Specifications
Thermal Diode
The Intel Celeron M processor incorporates two methods of monitoring die temperature, the Intel
Thermal Monitor and the thermal diode. The Intel Thermal Monitor (detailed in
be used to determine when the maximum specified processor junction temperature has been
reached. The second method, the thermal diode, can be read by an off-die analog/digital converter
(a thermal sensor) located on the motherboard, or a standalone measurement kit. The thermal diode
may be used to monitor the die temperature of the processor for thermal management or
instrumentation purposes but cannot be used to indicate that the maximum T
been reached. Please see
PROCHOT# signal is not asserted.
thermal diode signals, will not necessarily reflect the temperature of the hottest location on the die.
This is due to inaccuracies in the external thermal sensor, on-die temperature gradients between the
location of the thermal diode and the hottest location on the die, and time based variations in the die
temperature measurement. Time based variations can occur when the sampling rate of the thermal
diode (by the thermal sensor) is slower than the rate at which the T
The offset between the thermal diode based temperature reading and the Intel Thermal Monitor
reading may be characterized using the Intel Thermal Monitor’s automatic mode activation of
thermal control circuit. This temperature offset must be taken into account when using the
processor thermal diode to implement power management events.
NOTES:
Table 27
1. Intel does not support or recommend operation of the thermal diode under reverse bias. Intel does not
2. Characterized at 100 °C.
3. Not 100% tested. Specified by design/characterization.
4. The ideality factor, n, represents the deviation from ideal diode behavior as exemplified by the diode
Symbol
I
n
R
support or recommend operation of the thermal diode when the processor power supplies are not within their
specified tolerance range.
equation:
THERMDA
THERMDC
FW
T
and
Signal Name
Parameter
Forward Bias Current
Diode Ideality Factor
Series Resistance
Table 28
provide the diode interface and specifications.
Section 5.1.2
B18
A18
Thermal Specifications and Design Considerations
for thermal diode usage recommendation when the
5
1.00151
Min
Pin/Ball Number
Typ
1.00220
3.06
Max
300
1.00289
J
Thermal diode anode
Thermal diode cathode
temperature can change.
Signal Description
J
Unit
µA
ohms
of the processor has
Section
Notes
1
2, 3, 4
2, 3, 5
5.1) must
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