UDT020A0X3-SRZ Lineage Power, UDT020A0X3-SRZ Datasheet - Page 38

• Manufacturer Part Number: UDT020A0X3-SRZ
• Description: DC/DC Converters & Regulators 3-14.4Vin .6-5.5Vout 20A Neg SMT Digital
• Manufacturer: Lineage Power

Specifications of UDT020A0X3-SRZ

• Product: Non-Isolated / POL
• Input Voltage Range: 3 VDC to 14.4 VDC
• Input Voltage (nominal): 12 V
• Output Voltage (channel 1): 0.6 VDC to 5.5 VDC
• Output Current (channel 1): 20 A
• Output Voltage: 0.6 VDC to 5.5 VDC
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Preliminary Data Sheet
May 10, 2011
Surface Mount Information
Pick and Place
The 20A Digital Micro DLynx
frame construction and are designed for a fully
automated assembly process. The modules are fitted
with a label designed to provide a large surface area
for pick and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300
product information such as product code, serial
number and the location of manufacture.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended inside nozzle diameter
for reliable operation is 3mm. The maximum nozzle
outer diameter, which will safely fit within the allowable
component spacing, is 7 mm.
Bottom Side / First Side Assembly
This module is not recommended for assembly on the
bottom side of a customer board. If such an assembly
is attempted, components may fall off the module
during the second reflow process. If assembly on the
bottom side is planned, please contact Lineage Power
for special manufacturing process instructions.
Lead Free Soldering
The modules are lead-free (Pb-free) and RoHS
compliant and fully compatible in a Pb-free soldering
process. Failure to observe the instructions below
may result in the failure of or cause damage to the
modules and can adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
For questions regarding Land grid array(LGA)
soldering, solder volume; please contact Lineage
Power for special manufacturing process instructions.
The recommended linear reflow profile using Sn/Ag/Cu
solder is shown in Fig. 50. Soldering outside of the
recommended profile requires testing to verify results
and performance.
MSL Rating
The 20A Digital Micro DLynx
rating of 2.
LINEAGE
POWER
o
C. The label also carries
TM
TM
modules use an open
modules have a MSL
20A Digital Micro DLynx
3 – 14.4Vdc input; 0.45Vdc to 5.5Vdc output; 20A output
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages should
not be broken until time of use. Once the original
package is broken, the floor life of the product at
conditions of ≤ 30°C and 60% relative humidity varies
according to the MSL rating (see J-STD-033A). The
shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Figure 50. Recommended linear reflow profile
using Sn/Ag/Cu solder.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the testability
of the finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Board Mounted Power Modules: Soldering and
Cleaning Application Note (AN04-001).
TM
300
250
200
150
100
: Non-isolated DC-DC Power Modules
50
0
Per J-STD-020 Rev. C
Heating Zone
1°C/Second
Peak Temp 260°C
Reflow Time (Seconds)
* Min. Time Above 235°C
*Time Above 217°C
15 Seconds
60 Seconds
Cooling
Zone
38