UJA1075TW/3V3/WD,1 NXP Semiconductors, UJA1075TW/3V3/WD,1 Datasheet - Page 30
UJA1075TW/3V3/WD,1
Manufacturer Part Number
UJA1075TW/3V3/WD,1
Description
IC SBC CAN/LIN HS 3.3V 32HTSSOP
Manufacturer
NXP Semiconductors
Datasheet
1.UJA1075TW5V0118.pdf
(53 pages)
Specifications of UJA1075TW/3V3/WD,1
Controller Type
System Basis Chip
Interface
CAN, LIN
Voltage - Supply
4.5 V ~ 28 V
Current - Supply
83µA
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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8. Thermal characteristics
UJA1075_2
Product data sheet
Fig 13. HTSSOP PCB
Layout conditions for R
board, board dimensions 129 mm × 60 mm, board Material FR4, Cu thickness 0.070 mm, thermal
via separation 1.2 mm, thermal via diameter 0.3 mm ±0.08 mm, Cu thickness on vias 0.025 mm.
Optional heat sink top layer of 3.5 mm × 25 mm will reduce thermal resistance (see
PCB copper area:
(bottom layer)
2 cm
PCB copper area:
(bottom layer)
8 cm
2
2
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 27 May 2010
th(j-a)
measurements: board finish thickness 1.6 mm ±10 %, double-layer
High-speed CAN/LIN core system basis chip
optional heatsink top layer
optional heatsink top layer
optional heatsink top layer
UJA1075
© NXP B.V. 2010. All rights reserved.
015aaa137
Figure
14).
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