UJA1075TW/3V3/WD,1 NXP Semiconductors, UJA1075TW/3V3/WD,1 Datasheet - Page 50

• Manufacturer Part Number: UJA1075TW/3V3/WD,1
• Description: IC SBC CAN/LIN HS 3.3V 32HTSSOP
• Manufacturer: NXP Semiconductors

Specifications of UJA1075TW/3V3/WD,1

• Controller Type: System Basis Chip
• Interface: CAN, LIN
• Voltage - Supply: 4.5 V ~ 28 V
• Current - Supply: 83µA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
14. Revision history
Table 14.
UJA1075_2
Product data sheet
Document ID
UJA1075_2
Modifications:
UJA1075_1
Revision history
Release date
20100527
20091125
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Template upgraded to Rev. 2.11 including revised legal information
Figure
Table
Table
Table
Table
I
Table
Section
t
O
wake(busrec)min
for LIMP pin; R
4: bit 7: WOS revised
8: revised values/conditions - V
9: added
10: revised parameter values/conditions - V
11: revised parameter values/conditions - t
16,
6.7.1.2,
All information provided in this document is subject to legal disclaimers.
Figure
Data sheet status
Product data sheet
Product data sheet
Section
(BAT-V1)
18: revised
Rev. 02 — 27 May 2010
; V
6.8.1.2,
uvr
for pin V1
Table
ESD
11: parameters renamed to t
High-speed CAN/LIN core system basis chip
, I
R(V1-BAT)
Change notice
-
-
det(CL)L
th(cntr)RX
for RSTN pin
, V
th(hys)RX
Supersedes
UJA1075_1
-
wake(busdom)min
, V
OL
UJA1075
© NXP B.V. 2010. All rights reserved.
for RSTN pin,
,
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