UJA1075TW/3V3 NXP [NXP Semiconductors], UJA1075TW/3V3 Datasheet
UJA1075TW/3V3
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UJA1075TW/3V3 Summary of contents
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UJA1075 High-speed CAN/LIN core system basis chip Rev. 02 — 27 May 2010 1. General description The UJA1075 core System Basis Chip (SBC) replaces the basic discrete components commonly found in Electronic Control Units (ECU) with a high-speed Controller Area ...
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NXP Semiconductors 2. Features and benefits 2.1 General Contains a full set of CAN and LIN ECU functions: CAN transceiver and LIN transceiver Scalable 3 voltage regulator delivering up to 250 mA for a microcontroller and ...
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NXP Semiconductors Output signal (WBIAS) to bias the wake pins, selectable sampling time Standby mode with very low standby current and full wake-up capability; V1 active to maintain supply to the microcontroller Sleep mode ...
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... NXP Semiconductors 3. Ordering information Table 1. Ordering information [1] Type number Package Name UJA1075TW/5V0/WD HTSSOP32 UJA1075TW/3V3/WD UJA1075TW/5V0 UJA1075TW/3V3 [1] UJA1075TW/5V0xx versions contain regulator (V1); UJA1075TW/3V3xx versions contain a 3.3 V regulator (V1); WD versions contain a watchdog. 4. Block diagram BAT GND SCK SDI SDO SCSN WAKE1 WAKE WAKE2 WDOFF EN ...
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NXP Semiconductors 5. Pinning information 5.1 Pinning Fig 2. 5.2 Pin description Table 2. Symbol i.c. i.c. TXDL V1 RXDL RSTN INTN EN SDI SDO SCK SCSN TXDC RXDC TEST1 WDOFF LIMP UJA1075_2 Product data sheet i.c. 1 i.c. 2 ...
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NXP Semiconductors Table 2. Symbol WAKE1 WAKE2 V2 CANH CANL GND SPLIT LIN DLIN i.c. WBIAS VEXCC TEST2 VEXCTRL BAT The exposed die pad at the bottom of the package allows for better heat dissipation from the SBC via the ...
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NXP Semiconductors 6.1 System Controller 6.1.1 Introduction The system controller manages register configuration and controls the internal functions of the SBC. Detailed device status information is collected and presented to the microcontroller. The system controller also provides the reset and ...
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NXP Semiconductors V below BAT power-off threshold V th(det)poff (from all modes) V below BAT power-on threshold V th(det)pon CAN/LIN: Active/Lowpower successful watchdog trigger Fig 3. UJA1075 system controller UJA1075_2 Product data sheet Overtemp V1: OFF V2: OFF limp home ...
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NXP Semiconductors 6.1.2 Off mode The SBC switches to Off mode from all other modes if the battery supply drops below the power-off detection threshold (V and the bus systems are in a high-resistive state. The CAN bus pins are ...
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NXP Semiconductors • The chip temperature rises above the OTP activation threshold, T SBC to switch to Overtemp mode 6.1.5 Sleep mode Sleep mode is selected from Standby mode or Normal mode by setting bits MC in the Mode_Control register ...
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NXP Semiconductors SCS SCK 01 sampled SDI X SDO X floating Fig 4. SPI timing protocol 6.2.2 Register map The first three bits (A2, A1 and A0) of the message header define the register address. The fourth bit (RO) defines ...
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NXP Semiconductors 6.2.3 WD_and_Status register Table 4. WD_and_Status register Bit Symbol Access Power-on default 15:13 A2, A1 000 WMC R/W 0 [1] 10:8 NWP R/W 100 7 WOS/SWR R V1S R ...
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NXP Semiconductors 6.2.4 Mode_Control register Table 5. Mode_Control register Bit Symbol Access Power-on default 15:13 A2, A1 001 12 RO R/W 0 11:10 MC R/W 00 [1] 9 LHWC R/W 1 [2] 8 LHC R ENC ...
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NXP Semiconductors 6.2.5 Int_Control register Table 6. Int_Control register Bit Symbol Access Power-on default 15:13 A2, A1 010 V1UIE R V2UIE R STBCL R reserved R 0 ...
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NXP Semiconductors Table 6. Int_Control register Bit Symbol Access Power-on default 2 RTHC R WSE1 R WSE2 R/W 0 UJA1075_2 Product data sheet High-speed CAN/LIN core system basis chip Description reset threshold control 0: The reset ...
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NXP Semiconductors 6.2.6 Int_Status register [1] Table 7. Int_Status register Bit Symbol Access Power-on default 15:13 A2, A1 011 V1UI R V2UI R LWI R reserved R ...
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NXP Semiconductors 6.4 Watchdog (UJA1075/xx/WD versions) Three watchdog modes are supported: Window, Timeout and Off. The watchdog period is programmed via the NWP control bits in the WD_and_Status register (see default watchdog period is 128 ms. A watchdog trigger event ...
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NXP Semiconductors • the SBC is in Standby mode and bit WMC = 0 or • the SBC is in Normal mode and bit WMC = 1 6.4.3 Watchdog Off behavior The watchdog is disabled in this state. The watchdog ...
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NXP Semiconductors The reset pulse width (t generated undervoltage event (see (V > V BAT selected by connecting a 900 Ω ±10 % resistor between pins RSTN and V1 resistor is not connected, the reset ...
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NXP Semiconductors 6.6 Power supplies 6.6.1 Battery pin (BAT) The SBC contains a single supply pin, BAT. An external diode is needed in series to protect the device against negative voltages. The operating range is from 4 ...
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NXP Semiconductors current current Fig 7. Figure 7 current of 250 mA with PDC = 0. Any additional load current requirement will be supplied by the PNP transistor its current limit. If the load current continues to rise, ...
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NXP Semiconductors For short-circuit protection, a resistor needs to be connected between pins V1 and VEXCC to allow the current to be monitored. This resistor limits the current delivered by the external transistor. If the voltage difference between pins VEXCC ...
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NXP Semiconductors • the SBC is in Normal mode ( 11) • the transceiver is enabled (bit STBCC = 0; see and • enabled and its output voltage is above its undervoltage threshold ...
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NXP Semiconductors 6.7.2 Split circuit Pin SPLIT provides a DC stabilized voltage of 0.5V only. Pin SPLIT is floating in CAN Lowpower and Off modes. The V used to stabilize the recessive common-mode voltage by connecting pin SPLIT to the ...
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NXP Semiconductors 6.8.1 LIN operating modes 6.8.1.1 Active mode The LIN transceiver will be in Active mode when: • the SBC is in Normal mode ( 11) and • the transceiver is enabled (STBCL = 0; see ...
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NXP Semiconductors edge on pin TXDL. If the pin remains LOW for longer than the TXDL dominant time-out time (t to(dom)TXDL The timer is reset by a positive edge on the TXDL pin. 6.9 Local wake-up input The SBC provides ...
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NXP Semiconductors Fig 12. Typical application for cyclic sampling of wake-up signals 6.10 Interrupt output Pin INTN is an active-LOW, open-drain interrupt output driven LOW when at least one interrupt is pending. An interrupt can be cleared by ...
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NXP Semiconductors 7. Limiting values Table 8. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V voltage on pin reverse current from R(V1-BAT) pin V1 to pin BAT I current on ...
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NXP Semiconductors Table 8. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter T ambient amb temperature [1] A reverse diode connected between V1 (anode) and BAT (cathode) limits the voltage drop voltage from ...
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NXP Semiconductors 8. Thermal characteristics Fig 13. HTSSOP PCB UJA1075_2 Product data sheet PCB copper area: (bottom layer PCB copper area: (bottom layer measurements: board finish thickness 1.6 mm ±10 %, double-layer Layout conditions ...
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NXP Semiconductors R (K/W) Fig 14. HTSSOP32 thermal resistance junction to ambient as a function of PCB copper Table 9. Symbol R th(j-a) [1] According to JEDEC JESD51-2 and JESD51-3 at natural convection on 1s board. [2] According to JEDEC ...
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NXP Semiconductors 9. Static characteristics Table 10. Static characteristics − ° °C to +150 4 BAT are defined with respect to ground; positive currents flow in the IC; ...
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NXP Semiconductors Table 10. Static characteristics − ° °C to +150 4 BAT are defined with respect to ground; positive currents flow in the IC; typical values are ...
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NXP Semiconductors Table 10. Static characteristics − ° °C to +150 4 BAT are defined with respect to ground; positive currents flow in the IC; typical values are ...
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NXP Semiconductors Table 10. Static characteristics − ° °C to +150 4 BAT are defined with respect to ground; positive currents flow in the IC; typical values are ...
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NXP Semiconductors Table 10. Static characteristics − ° °C to +150 4 BAT are defined with respect to ground; positive currents flow in the IC; typical values are ...
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NXP Semiconductors Table 10. Static characteristics − ° °C to +150 4 BAT are defined with respect to ground; positive currents flow in the IC; typical values are ...
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NXP Semiconductors Table 10. Static characteristics − ° °C to +150 4 BAT are defined with respect to ground; positive currents flow in the IC; typical values are ...
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NXP Semiconductors Table 10. Static characteristics − ° °C to +150 4 BAT are defined with respect to ground; positive currents flow in the IC; typical values are ...
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NXP Semiconductors 10. Dynamic characteristics Table 11. Dynamic characteristics − ° °C to +150 4 BAT are defined with respect to ground; positive currents flow in the IC; ...
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NXP Semiconductors Table 11. Dynamic characteristics − ° °C to +150 4 BAT are defined with respect to ground; positive currents flow in the IC; typical values are ...
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NXP Semiconductors Table 11. Dynamic characteristics − ° °C to +150 4 BAT are defined with respect to ground; positive currents flow in the IC; typical values are ...
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NXP Semiconductors [7] The watchdog will be reset window mode and is triggered at least t watchdog period (or in the second half of the watchdog period). A system reset will be performed if the watchdog ...
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NXP Semiconductors Fig 17. Timing test circuit for LIN transceiver V TXDL V BAT LIN bus signal output of receiving V RXDL node A output of receiving V RXDL node B Fig 18. LIN transceiver timing diagram UJA1075_2 Product data ...
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NXP Semiconductors SCS t SPILEAD SCK SDI X floating SDO Fig 19. SPI timing diagram 11. Test information 11.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q100 - Failure mechanism based ...
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NXP Semiconductors 12. Package outline HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad y exposed die pad side pin 1 index 1 ...
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NXP Semiconductors 13. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 13.1 Introduction to ...
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NXP Semiconductors 13.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including ...
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NXP Semiconductors Fig 21. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. UJA1075_2 Product data sheet maximum peak temperature = MSL limit, damage level temperature ...
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NXP Semiconductors 14. Revision history Table 14. Revision history Document ID Release date UJA1075_2 20100527 • Modifications: Template upgraded to Rev. 2.11 including revised legal information • Figure • Table • Table • Table • Table I • Table • ...
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NXP Semiconductors 15. Legal information 15.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 16. Contact information For more information, please visit: For sales ...
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NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . ...