UJA1075TW/3V3 NXP [NXP Semiconductors], UJA1075TW/3V3 Datasheet - Page 30

• Manufacturer Part Number: UJA1075TW/3V3
• Description: High-speed CAN/LIN core system basis chip
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
8. Thermal characteristics
UJA1075_2
Product data sheet
Fig 13. HTSSOP PCB
Layout conditions for R
board, board dimensions 129 mm × 60 mm, board Material FR4, Cu thickness 0.070 mm, thermal
via separation 1.2 mm, thermal via diameter 0.3 mm ±0.08 mm, Cu thickness on vias 0.025 mm.
Optional heat sink top layer of 3.5 mm × 25 mm will reduce thermal resistance (see
PCB copper area:
(bottom layer)
2 cm
PCB copper area:
(bottom layer)
8 cm
2
2
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 27 May 2010
th(j-a)
measurements: board finish thickness 1.6 mm ±10 %, double-layer
High-speed CAN/LIN core system basis chip
optional heatsink top layer
optional heatsink top layer
optional heatsink top layer
UJA1075
© NXP B.V. 2010. All rights reserved.
015aaa137
Figure
14).
30 of 53