UJA1075TW/3V3 NXP [NXP Semiconductors], UJA1075TW/3V3 Datasheet - Page 45

• Manufacturer Part Number: UJA1075TW/3V3
• Description: High-speed CAN/LIN core system basis chip
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
11. Test information
UJA1075_2
Product data sheet
Fig 19. SPI timing diagram
11.1 Quality information
SDO
SCS
SCK
SDI
floating
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q100 - Failure mechanism based stress test qualification for integrated
circuits, and is suitable for use in automotive applications.
X
t
SPILEAD
X
t
clk(H)
t
su(D)
All information provided in this document is subject to legal disclaimers.
T
MSB
cy(clk)
t
t
clk(L)
h(D)
MSB
Rev. 02 — 27 May 2010
High-speed CAN/LIN core system basis chip
t
v(Q)
LSB
t
SPILAG
LSB
t
WH(S)
015aaa045
floating
X
UJA1075
© NXP B.V. 2010. All rights reserved.
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