UJA1075TW/3V3 NXP [NXP Semiconductors], UJA1075TW/3V3 Datasheet - Page 29

• Manufacturer Part Number: UJA1075TW/3V3
• Description: High-speed CAN/LIN core system basis chip
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
Table 8.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
UJA1075_2
Product data sheet
Symbol
T
amb
A reverse diode connected between V1 (anode) and BAT (cathode) limits the voltage drop voltage from V1(+) to BAT (-).
Verified by an external test house to ensure pins can withstand ISO 7637 part 2 automotive transient test pulses 1, 2a, 3a and 3b.
IEC 61000-4-2 (150 pF, 330 Ω).
ESD performance according to IEC 61000-4-2 (150 pF, 330 Ω) has been verified by an external test house for pins BAT, CANH, CANL,
LIN1, LIN2, WAKE1 and WAKE2. The result is equal to or better than ±6 kV.
Human Body Model (HBM): according to AEC-Q100-002 (100 pF, 1.5 kΩ).
V1, V2 and BAT connected to GND, emulating application circuit.
Machine Model (MM): according to AEC-Q100-003 (200 pF, 0.75 μH, 10 Ω).
Charged Device Model (CDM): according to AEC-Q100-011 (field Induced charge; 4 pF).
In accordance with IEC 60747-1. An alternative definition of virtual junction temperature is: T
fixed value to be used for the calculation of T
temperature (T
Limiting values
Parameter
ambient
temperature
amb
).
…continued
Conditions
All information provided in this document is subject to legal disclaimers.
vj
. The rating for T
Rev. 02 — 27 May 2010
vj
limits the allowable combinations of power dissipation (P) and ambient
High-speed CAN/LIN core system basis chip
vj
= T
amb
Min
−40
+ P × R
th(vj-a)
UJA1075
© NXP B.V. 2010. All rights reserved.
Max
+125
, where R
th(vj-a)
29 of 53
Unit
°C
is a