UBA2032TS/N2/N,118 NXP Semiconductors, UBA2032TS/N2/N,118 Datasheet - Page 38

• Manufacturer Part Number: UBA2032TS/N2/N,118
• Description: MOSFET & Power Driver ICs Full Bridg Driver IC
• Manufacturer: NXP Semiconductors

Specifications of UBA2032TS/N2/N,118

• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 935278859118

NXP Semiconductors
12. Package outline
Fig 16. Package outline SOT549-1 (HTSSOP32)
UJA1079_2
Product data sheet
HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
E h
VERSION
OUTLINE
SOT549-1
max.
32
1.1
1
A
Z
y
pin 1 index
0.15
0.05
A 1
0.95
0.85
A 2
IEC
0.25
A 3
exposed die pad side
e
0.30
0.19
b p
D h
D
0.20
0.09
c
All information provided in this document is subject to legal disclaimers.
MO-153
JEDEC
11.1
10.9
D
(1)
REFERENCES
0
Rev. 02 — 27 May 2010
D h
5.1
4.9
E
6.2
6.0
b
(2)
p
JEITA
scale
17
16
2.5
E h
3.6
3.4
w
c
M
0.65
e
A 2
5 mm
A 1
H E
8.3
7.9
L
1
0.75
0.50
L p
H E
E
PROJECTION
detail X
EUROPEAN
LIN core system basis chip
0.2
v
L
L
p
0.1
w
UJA1079
© NXP B.V. 2010. All rights reserved.
(A 3 )
0.1
y
A
ISSUE DATE
03-04-07
05-11-02
0.78
0.48
θ
X
Z
SOT549-1
A
v
M
8
0
θ
o
o
38 of 45
A