TDA9817 NXP Semiconductors, TDA9817 Datasheet - Page 39

• Manufacturer Part Number: TDA9817
• Manufacturer: NXP Semiconductors

Specifications of TDA9817

• Lead Free Status / Rohs Status: Compliant

Philips Semiconductors
Suitability of IC packages for wave, reflow and dipping soldering methods
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note ” (AN01026); order a copy
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
4. Hot bar soldering or manual soldering is suitable for PMFP packages.
5. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
6. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
7. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction.
8. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
9. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
10. Hot bar or manual soldering is suitable for PMFP packages.
11. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted
2004 Jun 29
Through-hole mount CPGA, HCPGA
Through-hole-
surface mount
Surface mount
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
from your Philips Semiconductors sales office.
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods” .
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 C
must be kept as low as possible.
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
The package footprint must incorporate solder thieves downstream and at the side corners.
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.
MOUNTING
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
BGA, HTSSON..T
SSOP-T
DHVQFN, HBCC, HBGA, HLQFP, HSO,
HSOP, HSQFP, HSSON, HTQFP, HTSSOP,
HVQFN, HVSON, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L
10 C measured in the atmosphere of the reflow oven. The package body peak temperature
(7)
(4)
, SO, SOJ
(5)
, TFBGA, USON, VFBGA
(11)
, PMFP
PACKAGE
(5)
, LBGA, LFBGA, SQFP,
(10)
, WQCCN32L
(1)
39
(11)
suitable
suitable
not suitable
not suitable
not suitable
suitable
not recommended
not recommended
not suitable
(3)
WAVE
(6)
SOLDERING METHOD
TDA9817; TDA9818
(7)(8)
(9)
not suitable
suitable
suitable
suitable
suitable
suitable
not suitable
REFLOW
Product specification
(2)
DIPPING
suitable