MT46H8M32LFB5-6:A Micron Technology Inc, MT46H8M32LFB5-6:A Datasheet - Page 89
![](/photos/31/34/313421/mfg557-90-vfbga_sml.jpg)
MT46H8M32LFB5-6:A
Manufacturer Part Number
MT46H8M32LFB5-6:A
Description
Manufacturer
Micron Technology Inc
Type
DDR SDRAMr
Datasheet
1.MT46H8M32LFB5-6A.pdf
(96 pages)
Specifications of MT46H8M32LFB5-6:A
Organization
8Mx32
Density
256Mb
Address Bus
14b
Access Time (max)
6.5/5ns
Maximum Clock Rate
166MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.95V
Operating Supply Voltage (min)
1.7V
Supply Current
120mA
Pin Count
90
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT46H8M32LFB5-6:A
Manufacturer:
MICRON
Quantity:
20 000
Company:
Part Number:
MT46H8M32LFB5-6:A TR
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Figure 49: Self Refresh Mode
Power-Down
PDF: 09005aef834bf85b
256mb_mobile_ddr_sdram_t36n.pdf - Rev. H 11/09 EN
Command
Address
CKE
DQS
CK#
CK
DM
DQ
1,2
1
Notes:
t
IS
t
IS
t
NOP
RP
T0
Power-down is entered when CKE is registered LOW. If power-down occurs when all
banks are idle, this mode is referred to as precharge power-down; if power-down occurs
when there is a row active in any bank, this mode is referred to as active power-down.
Entering power-down deactivates all input and output buffers, including CK and CK#
and excluding CKE. Exiting power-down requires the device to be at the same voltage as
when it entered power-down and received a stable clock. Note that the power-down
duration is limited by the refresh requirements of the device.
When in power-down, CKE LOW must be maintained at the inputs of the device, while
all other input signals are “Don’t Care.” The power-down state is synchronously exited
when CKE is registered HIGH (in conjunction with a NOP or DESELECT command).
NOP or DESELECT commands must be maintained on the command bus until
satisfied. See Figure 51 (page 91) for a detailed illustration of power-down mode.
4
t
t
IH
IH
t
1. Clock must be stable, cycling within specifications by Ta0, before exiting self refresh mode.
2. CKE must remain LOW to remain in self refresh.
3. AR = AUTO REFRESH.
4. Device must be in the all banks idle state prior to entering self refresh mode.
5. Either a NOP or DESELECT command is required for
CH
t
CL
t
IS
AR
T1
3
Enter self refresh mode
t
(
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89
256Mb: x16, x32 Mobile LPDDR SDRAM
Ta0
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1
t
CK
t
NOP
IS
t
XSR time with at least two clock pulses.
Ta1
Exit self refresh mode
t
XSR
(
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©2008 Micron Technology, Inc. All rights reserved.
5
t
IS
Valid
Valid
Tb0
Don’t Care
t
IH
Power-Down
t
XP is