MT47H128M8CF-3:HTR Micron Technology Inc, MT47H128M8CF-3:HTR Datasheet - Page 20

• Manufacturer Part Number: MT47H128M8CF-3:HTR
• Manufacturer: Micron Technology Inc

Specifications of MT47H128M8CF-3:HTR

• Lead Free Status / Rohs Status: Compliant

Figure 9: 60-Ball FBGA Package (8mm x 11.5mm) – x4, x8
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. V 6/10 EN
Dimensions apply to
solder balls post-
reflow on Ø0.35
SMD ball pads.
60X Ø0.45
8 CTR
Seating
0.12 A
plane
0.8 TYP
0.8 TYP
Notes:
A
9
8
7
1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or leaded Eutectic (62% Sn,
6.4 CTR
36%Pb, 2% Ag).
8 ±0.1
3
2
1
A
B
C
D
E
F
G
H
J
K
L
Exposed
gold-plated pad
1.0 MAX X 0.7
nonconductive
floating pad
0.8 ±0.1
Ball A1 ID
11.5 ±0.1
20
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1Gb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.2 MAX
© 2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging