LH7A400N0G000B5 NXP Semiconductors, LH7A400N0G000B5 Datasheet - Page 59
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LH7A400N0G000B5
Manufacturer Part Number
LH7A400N0G000B5
Description
Microcontrollers (MCU) LCD USB FS/HOST MMU ADC BGA256
Manufacturer
NXP Semiconductors
Datasheet
1.LH7A400N0G000B5.pdf
(65 pages)
Specifications of LH7A400N0G000B5
Data Bus Width
32 bit
Program Memory Type
ROMLess
Data Ram Size
80 KB
Interface Type
IrDA, SCI, SPI, SSP, UART, USB
Maximum Clock Frequency
200 MHz
Number Of Programmable I/os
60
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
BGA-256
Minimum Operating Temperature
- 40 C
Lead Free Status / Rohs Status
Details
Other names
LH7A400N0G000B5;55
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LH7A400N0G000B5
Manufacturer:
BROADCOM
Quantity:
500
Company:
Part Number:
LH7A400N0G000B5
Manufacturer:
Sharp Microelectronics
Quantity:
10 000
Company:
Part Number:
LH7A400N0G000B5,55
Manufacturer:
NXP Semiconductors
Quantity:
10 000
32-Bit System-on-Chip
PACKAGE SPECIFICATIONS
Preliminary data sheet
BGA256: plastic ball grid array package; 256 balls
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SOT1018-1
OUTLINE
VERSION
max
1.95
A
ball A1
index area
ball A1
index area
0.5
0.3
A
1
M
K
H
D
B
T
P
F
1.45
1.25
R
N
G
E
C
A
L
J
A
2
1
IEC
2
0.55
0.45
b
3
4
Figure 48. Package outline SOT1018-1 (BGA256)
17.2
16.8
5
D
e
6
7
15.75
14.75
D
8
JEDEC
D
e
D
1
1
1
9
10
17.2
16.8
REFERENCES
1/2 e
11
E
Rev. 01 — 16 July 2007
12
NXP Semiconductors
0
15.75
14.75
13
E
14
1
b
15
JEITA
16
e
1
scale
5
1/2 e
E
15
B
e
e
1
1
∅ w
∅ v
e
A
E
2
M
M
15
e
2
C
C
10 mm
A
0.25
v
B
A
A
0.1
w
2
A
y
1
0.15
1
y
C
PROJECTION
EUROPEAN
detail X
0.35
y
1
C
X
y
ISSUE DATE
07-07-07
07-07-07
SOT1018-1
LH7A400
59