PCA9698DGG,512 NXP Semiconductors, PCA9698DGG,512 Datasheet - Page 43

• Manufacturer Part Number: PCA9698DGG,512
• Description: IC I/O EXPANDER I2C 40B 56TSSOP
• Manufacturer: NXP Semiconductors

Specifications of PCA9698DGG,512

• Package / Case: 56-TSSOP
• Interface: I²C
• Number Of I /o: 40
• Interrupt Output: Yes
• Frequency - Clock: 1MHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Includes: POR
• Logic Family: PCA9698
• Number Of Lines (input / Output): 40.0 / 40.0
• Operating Supply Voltage: 2.3 V to 5.5 V
• Power Dissipation: 500 mW
• Operating Temperature Range: - 40 C to + 85 C
• Input Voltage: 5.5 V
• Logic Type: I2C Bus
• Maximum Clock Frequency: 1 MHz
• Mounting Style: SMD/SMT
• Number Of Input Lines: 40.0
• Number Of Output Lines: 40.0
• Output Current: 50 mA
• Output Voltage: 5.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: OM6281 - DAUGHTER CARD PCA9698 FOR OM6275
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-3241-5; 935278614512; PCA9698DGG

NXP Semiconductors
PCA9698
Product data sheet
16.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 16.
Table 17.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
≥ 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
•
•
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 16
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
All information provided in this document is subject to legal disclaimers.
17
43.
40-bit Fm+ I
Rev. 3 — 3 August 2010
Package reflow temperature (°C)
Volume (mm
< 350
235
220
Package reflow temperature (°C)
Volume (mm
< 350
260
260
250
2
C-bus advanced I/O port with RESET, OE and INT
3
3
)
)
Figure
350 to 2000
260
250
245
43) than a SnPb process, thus
≥ 350
220
220
245
> 2000
260
245
PCA9698
© NXP B.V. 2010. All rights reserved.
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