SI3019-F-FM Silicon Laboratories Inc, SI3019-F-FM Datasheet - Page 127

• Manufacturer Part Number: SI3019-F-FM
• Description: IC VOICE DAA GCI/PCM/SPI 20-QFN
• Manufacturer: Silicon Laboratories Inc
• Series: -r

Specifications of SI3019-F-FM

• Function: Data Access Arrangement (DAA)
• Interface: GCI, PCM, SPI
• Number Of Circuits: 1
• Voltage - Supply: 3 V ~ 3.6 V
• Current - Supply: 8.5mA
• Power (watts): *
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 20-VFQFN Exposed Pad
• Includes: *
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

D
Revision 1.01 to Revision 1.1
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Revision 1.1 to Revision 1.2
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Revision 1.2 to Revision 1.3
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OCUMENT
Added package thermal information in Table 1,
“Recommended Operating Conditions and Thermal
Information,” on page 5.
Added Note 10 to the transhybrid balance parameter
in Table 4 on page 8.
Updated Table 7, “Switching Characteristics—Serial
Peripheral Interface,” on page 11.
Removed R54 and R55 from " " on page 18.
Changed recommended DCV setting for Japan from
01 to 10 in Table 13 on page 22.
Updated initialization procedure in "5.3. Initialization"
on page 25.
Removed incorrect description of FDT bit in "5.8.
Exception Handling" on page 27.
Updated Billing Tone and Receive Overload section.
Changed to "5.22. Receive Overload Detection" on
page 35.
Updated text and added description of hybrid
coefficient format in "5.28. Transhybrid Balance" on
page 38.
Removed references to line-side revisions C and E.
Updated "8. Ordering Guide" on page 106.
Updated package information for 20-Pin TSSOP and
16-Pin SOIC on pages 103 and 104.
Added “14.Package Outline: 16-Pin TSSOP”.
Updated Table 7, “Switching Characteristics—Serial
Peripheral Interface,” on page 11.
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Updated Table 13, “Country-specific Register
Settings,” on page 22.
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Updated "5.3. Initialization" on page 25.
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Updated Figure 27, “Si3011/18/19 Signal Flow
Diagram,” on page 38.
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Updated "8. Ordering Guide" on page 106.
Updated Deep Sleep Total Supply Current from 1.0
to 1.3 mA typical
Updated package pictures
Removed all SPIM references (SPIM bit is never
present in any Si3050 device).
Removed SnPb package options
Updated delay time between chip selects.
Corrected ACIM settings for Brazil.
Revised Step 6 with standard hexadecimal notation.
Corrected HPF pole.
C
HANGE
L
IST
Rev. 1.4
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Revision 1.1 to Revision 1.31
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Revision 1.31 to Revision 1.4
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Minor typo corrections
The internal System-Side Revision value (REVA[3:0]
in Register 11) has been incremented by one for
Si3050 revision E.
Added Si3011 device specifications
Added Si3050, Si3011, Si3018, and Si3019 QFN
information
Si3050 + Si3011/18/19
127