PCA9510ADP,118 NXP Semiconductors, PCA9510ADP,118 Datasheet - Page 20

• Manufacturer Part Number: PCA9510ADP,118
• Description: IC I2C/SMBUS BUFF 8TSSOP
• Manufacturer: NXP Semiconductors
• Type: Bufferr

Specifications of PCA9510ADP,118

• Package / Case: 8-TSSOP
• Tx/rx Type: I²C Logic
• Delay Time: 35ns
• Capacitance - Input: 1.9pF
• Voltage - Supply: 2.7 V ~ 5.5 V
• Current - Supply: 6mA
• Mounting Type: Surface Mount
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.7 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-3358-2; 935279844118; PCA9510ADP-T

NXP Semiconductors
PCA9510A_4
Product data sheet
14.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 6.
Table 7.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 6
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
7
21.
Rev. 04 — 18 August 2009
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Hot swappable I
Figure
350 to 2000
260
250
245
21) than a SnPb process, thus
2
C-bus and SMBus bus buffer
220
220
350
PCA9510A
> 2000
260
245
245
© NXP B.V. 2009. All rights reserved.
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