PCA9508D,112 NXP Semiconductors, PCA9508D,112 Datasheet
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PCA9508D,112
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PCA9508D
PCA9508D
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PCA9508D,112 Summary of contents
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PCA9508 Hot swappable level translating I Rev. 01 — 28 April 2008 1. General description The PCA9508 is a CMOS integrated circuit that supports hot-swap with zero offset and provides level shifting between low voltage (down to 0.9 V) and ...
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... NXP Semiconductors This prevents a lock-up condition from occurring. The output pull-down on the A side drives a hard LOW and the input level is set at 0.5V lower LOW level in systems where the low voltage side supply voltage is as low as 0.9 V. Table 1 Table 1. Feature V range (V) CC(A) ...
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... NXP Semiconductors 3. Ordering information Table 2. Ordering information +85 C. amb Type number Topside Package mark Name PCA9508D PCA9508 SO8 PCA9508DP 9508 TSSOP8 [1] Also known as MSOP8. 4. Functional diagram PCA9508 SDAA SCLA V CC(B) pull-up resistor 0.55V / CC 0.45V CC UVLO 100 s DELAY EN Fig 1. Functional diagram of PCA9508 ...
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... NXP Semiconductors 5. Pinning information 5.1 Pinning V Fig 2. 5.2 Pin description Table 3. Symbol V CC(A) SCLA SDAA GND EN SDAB SCLB V CC(B) 6. Functional description Refer to The PCA9508 enables I without degradation of system performance. The PCA9508 contains two bidirectional open-drain buffers specifically designed to provide superior hot-swap and/or support up-translation/down-translation between the low voltage (as low as 0 ...
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... NXP Semiconductors HIGH long enough to complete the initialization state (t the SDA and SCL pins have been HIGH for the bus idle time or when all pins are HIGH and a STOP condition is seen on the SDAA and SCLA pins, SDAA is connected to SDAB and SCLA is connected to SCLB. ...
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... NXP Semiconductors 2 6.5 I C-bus systems As with the standard I HIGH levels on the buffered bus (standard open-collector configuration of the I The size of these pull-up resistors depends on the system, but each side of the repeater must have a pull-up resistor. This part designed to work with Standard-mode and Fast-mode I only specify 3 mA output drive ...
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... NXP Semiconductors On the B bus side of the PCA9508, the clock and data lines would have a positive offset from ground equal to the V be pulled to the V the end of the acknowledge, the level rises only to the LOW level set by the driver in the PCA9508 for a short delay while the A bus side rises above 0.5V HIGH ...
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... NXP Semiconductors SDAA SDA SCLA SCL BUS hot-swap PCA9508 MASTER and offset free EN Fig 6. Typical series application SCL SDA Fig 7. SCL SDA Fig 8. PCA9508_1 Product data sheet Hot swappable level translating SDAB SDAA SDAB SCLB SCLA SCLB hot-swap PCA9508 and offset free ...
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... NXP Semiconductors 8. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage port B CC(B) V supply voltage port A CC(A) V voltage on an input/output pin I/O I input current I P total power dissipation tot T storage temperature stg ...
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... NXP Semiconductors Table 5. Static characteristics 5.5 V; GND = Symbol Parameter Input and output SDAA and SCLA V HIGH-level input voltage IH V LOW-level input voltage IL V input clamping voltage IK I input leakage current LI I LOW-level input current IL V LOW-level output voltage OL I HIGH-level output leakage current ...
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... NXP Semiconductors 10. Dynamic characteristics Table 6. Dynamic characteristics 5.5 V; GND = Symbol Parameter t LOW-to-HIGH propagation delay PLH t HIGH-to-LOW propagation delay PHL t LOW to HIGH output transition time A side; TLH t HIGH to LOW output transition time A side; THL t LOW-to-HIGH propagation delay PLH t HIGH-to-LOW propagation delay ...
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... NXP Semiconductors 10.1 AC waveforms input 1 PHL 80 % 0.6 V output THL Fig 9. Propagation delay and transition times; B side to A side Fig 11. Propagation delay; B side to A side PCA9508_1 Product data sheet Hot swappable level translating I 3.0 V 1 PLH 1 0 TLH 002aad642 Fig 10. Propagation delay and transition times; ...
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... NXP Semiconductors wait 200 s EN SDAA SCLB SDAB SCLA Fig 12. t timing connect EN SCLB SDAB SDAA SCLA Fig 13. t timing idle(connect) Fig 14. t timing stop(connect) PCA9508_1 Product data sheet Hot swappable level translating SCLA t connect 0 V move until SCLA goes LOW ...
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... NXP Semiconductors 11. Test information Fig 15. Test circuit for open-drain outputs PCA9508_1 Product data sheet Hot swappable level translating I PULSE GENERATOR R = load resistor; 1. side; 167 load capacitance includes jig and probe capacitance termination resistance should be equal Rev. 01 — 28 April 2008 PCA9508 V CC(B) ...
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... NXP Semiconductors 12. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors TSSOP8: plastic thin shrink small outline package; 8 leads; body width pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors 13. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 13.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
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... NXP Semiconductors 13.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
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... NXP Semiconductors Fig 18. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 14. Abbreviations Table 9. Acronym CDM CMOS DUT ESD HBM 2 I C-bus I SMBus 15. Revision history Table 10. ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Functional description . . . . . . . . . . . . . . . . . . . 4 6.1 A side to B side 6.2 B side to A side 6.3 Weak drive on B side . . . . . . . . . . . . . . . . . . . . 5 6.4 Enable pin (EN 6.5 I C-bus systems ...