PX1011BI-EL1/G,551 NXP Semiconductors, PX1011BI-EL1/G,551 Datasheet - Page 26

• Manufacturer Part Number: PX1011BI-EL1/G,551
• Description: IC PCI-EXPRESS X1 PHY 81-LFBGA
• Manufacturer: NXP Semiconductors

Specifications of PX1011BI-EL1/G,551

• Package / Case: 81-LFBGA
• Applications: PCI Express MAX to PCI Express PHY
• Interface: JTAG
• Voltage - Supply: 1.2 V
• Mounting Type: Surface Mount
• Input Voltage Range (max): 0.31 V
• Maximum Operating Temperature: + 85 C
• Maximum Power Dissipation: 300 mW
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Operating Supply Voltage: 1.2 V
• Supply Current (max): 28 mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935282114551; PX1011BI-EL1/G-S; PX1011BI-EL1/G-S

NXP Semiconductors
PX1011B_4
Product data sheet
13.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 20.
Table 21.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 20
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
21
Rev. 04 — 4 September 2009
22.
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
22) than a SnPb process, thus
PCI Express stand-alone X1 PHY
220
220
350
> 2000
260
245
245
PX1011B
© NXP B.V. 2009. All rights reserved.
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