OM13001,598 NXP Semiconductors, OM13001,598 Datasheet - Page 110

• Manufacturer Part Number: OM13001,598
• Description: EA LPC177X/8X EVAL BOARD
• Manufacturer: NXP Semiconductors
• Series: -r
• Type: MCUr

Specifications of OM13001,598

• Contents: Board, Cable, Headphones, Registration Card
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: LPC1788
• Other names: 568-6707

NXP Semiconductors
LPC178X_7X
Objective data sheet
Fig 47. Reflow soldering of the TFBGA180 package
Footprint information for reflow soldering of TFBGA180 package
DIMENSIONS in mm
0.80
P
0.400
SL
0.400
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
SP
Hy
0.550
SR
P
12.575 12.575
Hx
Refer to the package outline drawing for actual layout
Hy
P
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 27 May 2011
Generic footprint pattern
Hx
32-bit ARM Cortex-M3 microcontroller
detail X
SR
SL
SP
see detail X
LPC178x/7x
© NXP B.V. 2011. All rights reserved.
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