BLKD815EPFVU Intel, BLKD815EPFVU Datasheet - Page 96

• Manufacturer Part Number: BLKD815EPFVU
• Manufacturer: Intel

Specifications of BLKD815EPFVU

• Lead Free Status / Rohs Status: Supplier Unconfirmed

Intel Desktop Board D815EFV/D815EPFV Technical Product Specification
2.13 Reliability
96
Table 56 provides maximum case temperatures for D815EFV and D815EPFV board components
that are sensitive to thermal changes. Case temperatures could be affected by the operating
temperature, current load, or operating frequency. Maximum case temperatures are important
when considering proper airflow to cool the D815EFV and D815EPFV boards.
Table 56.
The mean time between failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction
Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate
repair rates and spare parts requirements.
The Mean Time Between Failures (MTBF) data is calculated from predicted data at 35 ºC.
D815EFV and D815EPFV boards’ MTBF: 369,041 hours
For information about
Intel Pentium III processor datasheets and specification updates
Intel Celeron processor datasheets and specification updates
Component
Intel Pentium III processor
Intel Celeron processor
Intel 82815 GMCH/
Intel 82815EP MCH
Intel 82801BA ICH2
Thermal Considerations for Components
Maximum Case Temperature
For processor case temperature, see processor datasheets and
processor specification updates
116
109
o
o
C (under bias)
C (under bias)
Refer to
Section 1.3, page 18
Section 1.3, page 18